A mainboard

A motherboard and a part of the technology, applied in the server field, can solve problems such as obstruction, affecting the heat dissipation of OCP boards, poor heat dissipation of the motherboard, etc.

Inactive Publication Date: 2019-01-22
POWERLEADER COMPUTER SYST CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in order to improve the specifications of the server, an OCP standard has been formulated for the board, which defines the structural size requirements of the OCP board. The heat sink is located in the area between the board and the motherboard, and it is difficult for airflow to enter this area
This type of board has dual-network or four-network port specifications, and the air outlet area at the rear is obstructed, which seriously affects the heat dissipation of this type of OCP board.
Aiming at the problem of poor cooling effect of the motherboard mentioned above, no effective solution has been proposed yet

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A mainboard
  • A mainboard
  • A mainboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0025] An embodiment of the present disclosure provides a mainboard 100 for being arranged in a case. The mainboard 100 includes a storage pool 110. The storage pool 110 is set on the upper surface of the mainboard 100 for storing a heat-absorbing liquid. The storage pool 110 Including a valve 113 and a pipeline 114; the valve 113 divides the storage tank 110 into a first sub-storage tank 111 and a second sub-storage tank 112; the first sub-storage tank 111 is provided with a first opening 115; on the second sub-storage tank 112 A second opening 116 is provided; one end of the pipe 114 is connected to the first opening 115 ; the other end of the pipe 114 is connected to the second opening 116 .

[0026] In this embodiment, a storage pool 110 is provided on the upper surface of the main board 100 , and a heat-absorbing liquid is installed inside the storage pool 110 . The liquid in the first sub-storage tank 111 flows back into the second sub-storage tank 112 through the pipeli...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A mainboard which is placed in a chassis is provided. That mainboard comprises a storage tank disposed on an upper surface of the mainboard for storing a liquid having heat absorption property, wherein the storage tank comprise a valve and a pipe; A valve separates the storage pool into a first sub-storage pool and a second sub-storage pool; The first sub-storage pool is provided with a first opening; The second sub-storage pool is provided with a second opening; One end of the pipe is connected with the first opening; The other end of the pipe is connected to the second opening. The inventionsolves the technical problem that the heat dissipation area of the heat dissipation fin is small and the airflow is seriously hindered due to the high limit of the board card and the double or four network ports, so that the heat dissipation effect of the main board is poor.

Description

technical field [0001] This application relates to the field of servers, in particular, to a motherboard. Background technique [0002] At present, in order to improve the specifications of the server, an OCP standard has been formulated for the board, which defines the structural size requirements of the OCP board. The heat sink is located in the area between the board and the motherboard, and it is difficult for airflow to enter this area. This type of board has dual-network port or four-network port specifications, and the air outlet area at the rear is obstructed, which seriously affects the heat dissipation of this type of OCP board. For the above-mentioned problem of poor cooling effect of the motherboard, no effective solution has been proposed yet. Contents of the invention [0003] In order to at least solve the above technical problems, an embodiment of the present disclosure provides a motherboard, which is used to be arranged in a chassis. The motherboard inc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0203
Inventor 李强牛辉蔡坤刘祥六
Owner POWERLEADER COMPUTER SYST CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap