Phase-change heat dissipation chip structure and manufacturing method thereof

A chip structure and phase change technology, applied in electrical components, electric solid devices, circuits, etc., can solve problems such as chip stress, achieve the effects of reducing area, reducing pressure, and improving heat dissipation efficiency

Active Publication Date: 2019-01-15
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a phase change heat dissipation chip for the problems of phase change expansion of the filled phase change material in the chip in the prior art, which easily causes stress on the chip, and how to quickly release heat from the material that undergoes phase change expansion. The structure and its preparation method enable the material that absorbs heat and undergoes a phase change to quickly release heat, avoiding stress inside the chip and improving the reliability of the chip

Method used

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  • Phase-change heat dissipation chip structure and manufacturing method thereof
  • Phase-change heat dissipation chip structure and manufacturing method thereof
  • Phase-change heat dissipation chip structure and manufacturing method thereof

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Embodiment approach

[0061] According to one embodiment of the present invention, a phase change heat dissipation chip structure is provided, including a cover plate and a wafer:

[0062] refer to figure 1 , the lower surface of the cover plate 5 is bonded to the back surface of the wafer 6, the lower surface of the cover plate 5 is provided with a cavity 7, the back surface of the wafer 6 is provided with a cavity 8, the cavity 7 communicates with the cavity 8, and the cavity 7 or There is a phase change material stored in the empty slot 8 .

[0063] At this stage, the main improvement direction for phase change heat dissipation is to improve the heat transfer capacity of phase change materials. According to the phase change temperature point, select the appropriate phase change material. After the phase change material absorbs heat, it will undergo a solid-to-liquid transition or a liquid-to-gas transition. , so as to maintain the slow temperature rise of the chip.

[0064] The solid phase cha...

Embodiment 1

[0152] figure 1 According to an embodiment of the present invention, the structure of the phase-change heat dissipation chip, figure 2 A phase-change heat dissipation chip structure according to an embodiment of the present invention, image 3 Another phase change heat dissipation chip structure according to an embodiment of the present invention.

[0153] like figure 1 As shown, the embodiment provides a phase change heat dissipation chip structure, including a cover plate 5 and a wafer 6:

[0154] The lower surface of the cover plate 5 is bonded to the back surface of the wafer 6, the lower surface of the cover plate 5 is provided with a cavity 7, the back surface of the wafer 6 is provided with a cavity 8, the cavity 7 communicates with the cavity 8, and the cavity 7 or the cavity The slot 8 contains a phase change material.

[0155] The structure also includes a heat sink 9 disposed on the upper surface of the cover plate 5 ; and a conductive bump 11 mounted on the fr...

Embodiment 2

[0160] Figure 4 A flowchart of a wafer-level manufacturing method for phase change heat dissipation according to an embodiment of the present invention. Figure 5(A) ~ Figure 5(F) They are schematic structural diagrams of different stages in the wafer-level manufacturing process of phase change heat dissipation according to an embodiment of the present invention.

[0161] like Figure 4 As shown, this embodiment provides a wafer-level preparation method for phase change heat dissipation, including the following steps:

[0162] Step 101: Provide a wafer 201, etch the back of the wafer 101 to form a plurality of hollow grooves 103, and the depth of the hollow grooves 203 does not touch the deep well region close to the wafer 201, as shown in FIG. 5(A) ;

[0163] Etching the back of the wafer 201 to form a plurality of empty grooves 203, the back of the wafer 201 needs to be thinned;

[0164] Step 102: Provide a cover plate 202 with the same size as the wafer 201, etch the l...

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Abstract

A phase change heat dissipation chip structure and a manufacturing method thereof. The phase change heat dissipation chip structure comprises a cover plate and a wafer. The lower surface of the coverplate is bonded with the back surface of the wafer, the lower surface of the cover plate is provided with a cavity, the back surface of the wafer is provided with a hollow groove, the cavity is communicated with the hollow groove, and the cavity or the hollow groove contains a phase change material; Phase change material (PCM) fills the cavity or slot, heat endothermally changes into liquid or gaseous state, and the volume expansion of PCM will produce pressure on the chip and the cover plate, thereby affecting the reliability of the chip. The cavity of the cover plate provides the storage space of the PCM after volume expansion, reduces the stress between the chip and the cover plate, and improves the reliability of the chip.

Description

technical field [0001] The invention relates to the technical field of semiconductors, and more specifically, to a phase-change heat dissipation chip structure, a single-chip wafer-level preparation method and a wafer-level system packaging preparation method thereof. Background technique [0002] Chip thermal management methods are divided into active heat dissipation and passive heat dissipation. Passive heat dissipation includes: heat conduction (heat sink); active heat dissipation includes: phase change heat dissipation, liquid metal heat dissipation, micro-channel heat dissipation, thermoelectric heat dissipation, forced air cooling; With the reduction of the size of a single chip and the increase of power, the resulting unit heat flux increases rapidly. [0003] In three-dimensional packaging, with the integration and stacking of various chips, a large amount of heat accumulates in the package. Traditionally, forced air cooling of chips through heat sinks can only dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427
CPCH01L23/427H01L23/4275H01L2224/18H01L2224/73253H01L2924/10155
Inventor 陈达
Owner NINGBO SEMICON INT CORP
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