Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Interface defect detection method based on improved multi-reflection total focus imaging algorithm

A technology for multiple reflection and defect detection, which is applied in measuring devices, analyzing solids using sound waves/ultrasonic waves/infrasonic waves, and using sound waves/ultrasonic waves/infrasonic waves for material analysis, etc., can solve problems such as debonding strength weakening, and achieve defect feature enhancement , Improving the effect of accuracy and detection rate

Active Publication Date: 2021-11-26
FUZHOU UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of processing and use, it is inevitable that there will be defects such as debonding, holes, microporosity and strength weakening in the bonding layer.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Interface defect detection method based on improved multi-reflection total focus imaging algorithm
  • Interface defect detection method based on improved multi-reflection total focus imaging algorithm
  • Interface defect detection method based on improved multi-reflection total focus imaging algorithm

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0039] The invention provides a method for detecting interface defects based on an improved multi-reflection total-focus imaging algorithm, and the detection object is such as figure 1 Debonding defects of the bonded structure shown, including the following steps

[0040] Step S1: According to the interface depth S and the time required for receiving P echoes, set the instrument parameters: assuming that the propagation speed of the sound wave in the workpiece is c, the maximum distance from the array element in the probe to the target imaging point (x, z) is u, Set the gate time T for the instrument to receive the echo as:

[0041]

[0042] Step S2: adopt full matrix capture technology to carry out echo capture of the workpiece to be measured;

[0043] Step S21: Sequentially excite each element of the phased array probe to emit ultrasonic waves, a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to an interface type defect detection method based on an improved multi-reflection total focus imaging algorithm, comprising the following steps: Step S1: according to the interface depth S and receive P The duration required for the secondary echo, set the instrument parameters; Step S2: use the full matrix capture technology to capture the echo of the workpiece to be measured; Step S3: use the improved multiple reflection total focusing algorithm to virtualize each target imaging point discrete in the area to be measured Focusing to obtain the detection results of interface defects in the area to be tested. Based on the improved multi-reflection total focus imaging algorithm, the present invention collects multiple echoes and accumulates the target imaging point information contained in each echo in depth, thereby highlighting the characteristics of the interface defect and greatly improving the accuracy of the debonding defect. The detection rate.

Description

technical field [0001] The invention relates to the technical field of defect positioning in ultrasonic nondestructive testing, in particular to an interface defect detection method based on an improved multi-reflection total focus imaging algorithm. Background technique [0002] The bonded structure has the characteristics of high specific strength and specific modulus, superior shock absorption performance and simple process, and has gradually replaced the traditional combination technology in the field of industrial manufacturing and other fields. However, in the process of processing and use, defects such as debonding, holes, micropores and strength weakening will inevitably appear in the bonding layer. Therefore, it is of great practical significance to study an efficient and accurate nondestructive testing method for bonded structures. [0003] In recent years, ultrasonic phased arrays have gradually been developed and applied in the field of non-destructive testing f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/04G01N29/07
CPCG01N29/043G01N29/07G01N2291/011G01N2291/023G01N2291/0422
Inventor 钟舜聪范学腾伏喜斌沈耀春
Owner FUZHOU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com