A silicon wafer loading device and loading method thereof

Abstract

The invention discloses a silicon wafer loading device, which comprises a suction cup located in the y direction; a silicon wafer table located below the suction cup and cooperating with the suction cup; the silicon wafer table has; a base; One block is located above the base, the line connecting the two first blocks is parallel to the x direction, and the first block is located in the negative x direction; two second blocks are respectively located above the first block, and the second block is located above the first block. One of the two blocks is located in the negative x direction; two third blocks are respectively located above the second block, and the third block is located in the negative x direction; two loading components are respectively located above the third block , the two loading components are symmetrical about the y direction. This equipment can move in all directions, suitable for silicon wafer samples of various sizes, with a wide application range, and the silicon wafer samples are firmly adsorbed.

Description

technical field [0001] The invention relates to the field of silicon wafers, in particular to a silicon wafer loading device and a loading method thereof. Background technique [0002] Chips are modern miniature "knowledge bases" with super-storage capabilities. The size, thickness, surface damage, and shape defects of the silicon wafer will have a huge impact on the performance of the silicon wafer, so it is necessary to perform fine measurement of the surface information of the silicon wafer. In the prior art, the optical measuring equipment used for measuring the surface information of silicon wafers loads silicon wafers through a silicon wafer buffer loading device during use. [0003] For example, the patent document CN201210479223.1 is a silicon wafer buffer loading device, including a silicon wafer table and a suction cup, the suction cup is matched with the silicon wafer table, the silicon wafer table has a base, and it is characterized in that it also includes a bu...

AI Technical Summary

Problems solved by technology

[0004] One of the technical problems of the object of the present invention is that the buffer loading device for silicon wafers in the prior art has a small application range and unstable adsorption of silicon wafers. A silicon wafer loading device is provided, which is suitable for silicon wafers of various sizes and expands its application range, and the silicon wafer is firmly adsorbed

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