Laser selective melting forming equipment and method

Abstract

The invention belongs to the related technical field of additive manufacturing, and discloses a laser selective melting forming equipment and method. The vibration device, the excitation coil group includes a plurality of excitation coils; the plurality of excitation coils and the ultrasonic vibration device are arranged around the substrate of the forming cavity when used; the excitation coil is connected to the industrial computer and the adjustable resistor, and the electronic voltage regulator The device is connected to the exciting coil and the adjustable resistor; the ultrasonic power supply is connected to the single-chip microcomputer and the ultrasonic vibration device, and the single-chip microcomputer is also connected to the electronic voltage regulator; the industrial computer is used to control the laser scanning according to different phase angles. The angle and opening and closing of the excitation coil group are used to realize the partition control of the magnetic field; the single chip microcomputer is used to control the amplitude and frequency of the ultrasonic vibration device. The invention realizes high-performance laser selective melting and forming, and improves tissue consistency.

Description

technical field [0001] The invention belongs to the technical field related to additive manufacturing, and more specifically relates to a laser selective melting forming equipment and method. Background technique [0002] In recent years, additive manufacturing technology has developed very rapidly and has been widely used in aerospace, biomedicine and other fields. Among them, laser selective melting forming technology can directly manufacture high-performance metal parts from CAD models and metal powder / wire materials. The STL file is sliced ​​according to a certain layer thickness to generate a two-dimensional laser processing trajectory, and the equipment pre-lays / coaxially inputs the metal powder according to the generated processing trajectory. After the scan is completed, the substrate is lowered to a certain depth and the process is repeated until the part is completed, layer by layer to complete the preparation of the entire metal part. [0003] Due to the laser s...

AI Technical Summary

Problems solved by technology

The purpose of this equipment is to refine the grains, reduce thermal stress, eliminate thermal cracks, pores and columnar crystals by affecting the solidification and crystallization process without changing the material composition, and solve the problem of forming parts in the laser selective melting forming technology. Metallurgical defects such as holes and cracks and anisotropy caused by columnar crystals

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