An LGA device printing patch auxiliary device

An auxiliary device and patch technology, which is applied in the direction of assembling printed circuits, printed circuits, and printed circuits with electrical components, can solve the problems of difficulty in making chip-level stencil tooling, low success rate of solder paste printing, and high difficulty in manufacturing processes. Achieve the effects of reducing the risk of tin bead hidden dangers, reducing the difficulty and cost of production, and making the production process less difficult

Pending Publication Date: 2018-12-28
XIAN NORTH ELECTRO OPTIC TECH DEFENSE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the auxiliary device for printing and patching of LGA devices provided by the present invention is to overcome the need for more raw materials, long production cycle, high difficulty of production process and low success rate of solder paste printing for each design and production of Zhongyuan chip-level stencil tooling in the prior art. The second purpose is to overcome the miniaturization and integration requirements of the design in the circuit board assembly (PCBA) of the high-density mounting design in the prior art, and the density of components is getting higher and higher, and chips that need to be partially mounted The surrounding area is full of other types of components, and local solder paste printing in a small space makes it extremely difficult to manufacture chip-level stencil tooling. The problem

Method used

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  • An LGA device printing patch auxiliary device
  • An LGA device printing patch auxiliary device
  • An LGA device printing patch auxiliary device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] An auxiliary device for LGA device printing and patching includes a chip 10, a squeegee blade, and a chip-level steel mesh 6. The LGA device printing and patching auxiliary device at least further includes an auxiliary steel sheet 1, a chip X-axis direction connector 2, and a chip Y Axis direction connector 3, base 4, Z-axis direction adjustment connector 5, multiple upper support seats 7 and multiple lower support seats 8, upper support seats 7 are connected to the corners of the base 4, the base 4 The bottom corners are all connected with a lower support base 8, a hole 9 is opened in the middle of the base 4, the chip 10 is horizontally connected to the hole 9 through the chip X-axis direction connector 2, and the chip 10 is longitudinally passed through the chip Y-axis direction connector 3 is connected to the hole 9, the left and right ends of the upper middle of the base 4 are connected to the Z-axis direction adjustment connector 5, the chip-level steel mesh 6 is co...

Embodiment 2

[0032] Such as Figure 3-7 As shown, an auxiliary device for printing and attaching an LGA device includes a chip 10, a squeegee blade, and a chip-level steel mesh 6. The auxiliary device for printing and attaching an LGA device at least further includes an auxiliary steel sheet 1 and a chip X-axis direction connector 2 , Chip Y-axis direction connector 3, base 4, Z-axis direction adjustment connector 5, multiple upper support seats 7 and multiple lower support seats 8, upper support seats 7 are connected to the corners of the base 4 , The lower support base 8 is connected to the corners below the base 4, the middle of the base 4 is provided with a hole 9, the chip 10 is connected in the hole 9 through the chip X-axis direction connector 2 in the transverse direction, and the chip 10 is longitudinally passed through the chip Y axis. The direction connector 3 is connected in the hole 9, the left and right ends of the upper middle of the base 4 are connected to the Z-axis directi...

Embodiment 3

[0048] On the basis of embodiment 2, the auxiliary steel sheet 1 is a magnetic auxiliary steel sheet, and a plurality of magnetic contacts 12 are arranged under the base 4, and a plurality of magnetic contacts 12 are distributed along the circumference of the hole 9 On the underside of the base 4, a magnetic auxiliary steel sheet is connected to the underside of the base 4 through a plurality of magnetic contacts 12. The auxiliary steel sheet 1 is fixed on the bottom surface of the base 4 in a magnetic attraction type through a magnetic attraction type contact, which is convenient to disassemble and facilitate the pickup of this type of chip after flipping.

[0049] The chip-level steel mesh 6 is a flat steel mesh, and the flat steel mesh is provided with openings 11 whose area is equal to the area of ​​the substrate surface contact 13 of the chip 10. Flat steel mesh requires less raw materials, short production cycle, low production process difficulty, high solder paste printing...

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Abstract

The invention belongs to the technical field of modern electronic assembly engineering surface mount technology (SMT), and relates to an LGA device printing patch auxiliary device including a chip, awiper blade and a chip-scale steel mesh and further comprising an auxiliary steel sheet, a chip X-axis direction connector, a chip Y-axis direction connector, a base, a Z-axis direction adjusting connector, a plurality of upper support seats and a plurality of lower support seats. The conventional chip-level steel mesh tool has the problems of many raw materials, low manufacture period, high manufacture process difificulty and low success rate of tin paste printing during each manufacture and design. The invention simplifies the design and manufacture of the original chip-level steel screen, makes the operation more convenient, and greatly improves the success rate of the local solder paste printing and the local mounting of the type of chip.

Description

Technical field [0001] The invention belongs to the technical field of surface mount technology (SMT) of modern electronic assembly engineering, and specifically relates to an auxiliary device for printing and patching of LGA devices. Background technique [0002] With the rapid development of chip manufacturing technology, LGA (Land grid array, literally translated as grid array packaging, corresponds to the previous packaging technology of Intel processors Socket 478, which is also called Socket T) surface contact array packaging chips (see figure 1 ) It is mostly in the form of μmodule to accommodate more I / O terminals and low pin impedance. It is widely used in high-density mounting design of circuit board assemblies (PCBA). [0003] The original board-level partial placement and partial rework placement of this type of chip require the design and production of a dedicated chip-level steel mesh tooling with an extraction handle (see figure 2 ). [0004] Defects of the original c...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/3436H05K2201/10719
Inventor 程霄史静云曹凯梁颖张锐
Owner XIAN NORTH ELECTRO OPTIC TECH DEFENSE
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