A transfer method for large area monolayer and few-layer molybdenum disulfide film

Abstract

The invention provides a transfer method for large area monolayer and few-layer molybdenum disulfide film. The method uses the adhesive tape as a support for transferring the molybdenum disulfide film, polymer film is used asan insulating layer between molybdenum disulfide and transparent glue, the polymer film and molybdenum disulfide film are tightly adhered to the adhesive tape, which reduces the breakage of the film when the molybdenum disulfide film is separated from the growth substrate and facilitates the collection of the molybdenum disulfide film. At the same time, the transfer of molybdenum disulfide film and polymer film can be realized through the transfer glue during the transfer process, and the molybdenum disulfide film will not be damaged. As that precursor is immerse in acetone to separate the adhesive tape and the polymer film from the molybdenum disulfide film, the invention ensures that the adhesive tape doe not damage the molybdenum disulfide film in the detachmentprocess, and is favorable for realizing relatively complete transfer of a large-area single-layer molybdenum disulfide film or a small-layer molybdenum disulfide film.

Description

technical field [0001] The invention relates to the technical field of film transfer, in particular to a method for transferring large-area single-layer and few-layer molybdenum disulfide films. Background technique [0002] With the development of semiconductor technology, traditional silicon-based integrated circuits have encountered serious bottlenecks due to size problems. Two-dimensional materials such as graphene and molybdenum disulfide have attracted widespread attention due to their atomic thickness. Compared with graphene, single-layer molybdenum disulfide has a direct band gap with a width of 1.8eV, so single-layer molybdenum disulfide can be used in transistors and other memory devices. Studies have shown that the switching ratio of transistors with layered molybdenum disulfide as the channel can reach 1×10 7 ~1×10 8 , the carrier mobility can reach 200cm 2 ·V -1 ·S -1 . It can be seen that compared with graphene, molybdenum disulfide has more development p...

AI Technical Summary

Problems solved by technology

At present, the following three problems generally exist in the process of transferring a large-area single-layer or few-layer molybdenum disulfide film from a growth substrate to a target substrate: First, when the molybdenum disulfide film is separated from the growth substrate, due to The single-layer or few-layer molybdenum disulfide film is too thin, it is easy to break into small pieces in the solution, and it is difficult to collect; second, even if the molybdenum disulfide film and the growth substrate are not broken into small pieces during the separation process, In the process of transferring the molybdenum disulfide thin film to the target substrate, the molybdenum disulfide thin film is prone to large-area wrinkles, and it will be affected by severe stress, resulting in cracks. samples, and the quality of the molybdenum disulfide film after transfer cannot be guaranteed; thirdly, most of the current transfer methods are to spin-coat a layer of polymer film on the surface of the molybdenum disulfide film, and then clean and remove the polymer film after the transfer is completed. However, if the polymer film is too thin, it is easy to break in the solution and cannot play a corresponding role. If the polymer film is too thick, there is a problem that it is difficult to clean and remove after the transfer is completed.

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