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A superheterodyne frequency conversion chip based on SIP technology

A superheterodyne technology, applied in the field of communication, can solve the problems of radio frequency performance deterioration between multiple channels, reduce structural size, etc., achieve the effect of reducing performance inconsistency and reliability hidden dangers, reducing size, and improving radio frequency performance deterioration

Inactive Publication Date: 2018-12-21
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the problems existing in the above-mentioned prior art, the object of the present invention is to provide a superheterodyne frequency conversion chip based on SIP technology, which can greatly reduce the structure size, and improve the degradation of radio frequency performance caused by the interconnection structure and the communication between multiple channels. Consistency issues can meet the needs of ultrashort wave miniaturized receivers, especially multi-channel miniaturized receivers

Method used

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  • A superheterodyne frequency conversion chip based on SIP technology
  • A superheterodyne frequency conversion chip based on SIP technology

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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0018] Such as figure 1 As shown, a superheterodyne frequency conversion chip based on SIP technology adopts a system-in-package package, and the external packaging form is a grid array; it includes a ceramic shell and a multi-layer high-density ceramic circuit board with a cavity, and the multi-layer high-density belt A low-pass filter for receiving radio frequency input, a first attenuator for receiving local oscillator input, a first low-noise amplifier connected to the first attenuator, a low-pass filter for receiving and a second A mixer output by a low-noise amplifier, and a first band-pass filter, a second low-noise amplifier, a second band-pass filter, a second attenuator, and a third band-pass filter connected in sequence after the mixer device and a third low-noise amplifier, and the third low-noise amplifier is used to output an intermediate frequ...

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Abstract

The invention discloses a superheterodyne frequency conversion chip based on SIP technology, belonging to the technical field of communication. It is a miniaturized superheterodyne frequency conversion chip working in the ultrashort wave band, including frequency converter, filter, amplifier and other components. A superheterodyne frequency conversion circuit for ultrashort wave is integrated on ahigh-density multilayer band-cavity ceramic circuit base board by utilizing MMIC, IPD, FBAR, SIP and other technology, and that ceramic shell is packaged by conductive adhesive bonding to form a functionally independent LGA packaging chip. Compared with the conventional technology, the invention greatly reduces the structure size of the circuit, improves the radio frequency performance degradation and channel consistency problems introduced by the interconnection structure, and is particularly suitable for miniaturized ultra-short wave receivers.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a superheterodyne frequency conversion chip based on SIP technology. Background technique [0002] Facing the miniaturization and multi-function requirements of wireless communication systems, designing miniaturized radio frequency circuits based on System InPackage (SIP) has become a research hotspot in the field of electronics at home and abroad, and is considered to be the key to the future development of radio frequency electronic technology. mainstream trend. [0003] At present, the existing ultrashort-wave superheterodyne frequency conversion modules generally adopt traditional printed board technology, use packaged components to build circuits, and the module RF interconnection structure adopts traditional coaxial sockets, and the module size is relatively large. The traditional ultrashort wave RF front-end cannot well meet the requirements of airborne equipment f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/26
CPCH04B1/26
Inventor 宋庆辉刘俭成李晓明郑见树杜江坤石国超王璇于慧贤
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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