A gripping device for a semiconductor handling apparatus having a collision prevention function

Abstract

The invention discloses a gripping device of a semiconductor handling device having a collision prevention function, include support column, A base is fixedly installed on the outer surface of the upper end of the support column, and a turntable is arranged above the base, A contact column and a fixing plate are fixedly installed on the outer surface of the upper end of the turntable, and the turntable is positioned on one side of the fixing plate; a support plate is fixedly installed on the outer surface of the front end of the turntable; an expansion and contraction mechanism is arranged onthe outer surface of the fixing plate; and the expansion and contraction mechanism comprises movable arms which are movably installed on the outer surfaces on both sides of the fixing plate near the front end. As that invention is use, At first, that surface of the substrate is intact to avoid affect the subsequent process treatment; secondly, the length of the telescopic mechanism can be easily adjust according to the depth of the semiconductor substrate box by a user; furthermore, the rotation angle of the telescopic mechanism is prevented from being too large to misplace the substrate, andthe accuracy of the substrate position is increased. The substrate can be prevented from being damaged by collision.

Description

technical field [0001] The invention relates to the field of handling and grabbing equipment, in particular to a grabbing device for semiconductor handling equipment with an anti-collision function. Background technique [0002] Handling operations include substrate feeding and handling, translation, rotation within the process, transportation between processes, extraction, etc. The grabbing device of the semiconductor handling equipment with anti-collision function refers to the device used to remove the substrate from the box or box. However, the existing grabbing device has certain disadvantages when it is used. First, it is easy to damage the substrate, which affects the subsequent processing of it. Secondly, it is not convenient for the user to adjust the length of the distance between the box and the device. The length of the grabbing distance of the device, and the difficulty in controlling the relative rotation angle between the turntable and the base, reduce the acc...

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Problems solved by technology

[0002] Handling operations include substrate feeding and handling, translation, rotation within the process, transportation between processes, extraction, etc. The grabbing device of the semiconductor handling equipment with anti-collision function refers to the device used to remove the substrate from the box or box. However, the existing grabbing device has certain disadvantages when it is used. First, it is easy to damage the substrate, which affects the subsequent processing of it. Secondly, it is not convenient for the user to adjust the length of the distance between the box and the device. The length of the grabbing distance of the device, and it is difficult to control the relative rotation angle between the turntable and the base, which reduces the accuracy of the substrate falling when it loosens the substrate

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