Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A transport steering device for semiconductor and pan-semiconductor substrates

A steering device and semiconductor technology, which is applied in the field of semiconductors and pan-semiconductors, can solve problems such as collisions, easy deviation or slipping, and surface damage, and achieve the effects of protecting the safety of the substrate, avoiding surface wear, and ensuring processing quality

Pending Publication Date: 2018-12-18
浙江雅市晶科技有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor and pan-semiconductor substrate transport steering device, which solves the problem that in the existing semiconductor and pan-semiconductor processing, the substrate needs to be transported at a corner during transportation, and there is no corresponding protection. The fixing mechanism makes it easy to shift or slip during the adjustment process, causing damage to the surface or collision during transportation, making it difficult to guarantee the processing quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A transport steering device for semiconductor and pan-semiconductor substrates
  • A transport steering device for semiconductor and pan-semiconductor substrates
  • A transport steering device for semiconductor and pan-semiconductor substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1-3 , the present invention provides a technical solution: a semiconductor and pan-semiconductor substrate transportation steering device, including a bottom box 1, the middle position of the inner cavity bottom of the bottom box 1 is rotatably connected with a rotating shaft 2, and the outer surface of the rotating shaft 2 is located in the bottom box 1 The position close to the top of the chamber is fixedly connected with the driven wheel ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A transport steering device for semiconductor and pan-semiconductor substrates Including bottom box, A support plate is fixedly connecte with that top end of the rotating shaft, At that top two side of the support plate are fixedly connected with the transmission plate through the support frame, A lif device is fixedly connected with that middle position of the bottom of the transmission plate, Apartition plate is fixedly connected with the front face and the back face of the top of the transmission plate, a plurality of transmission rollers are arranged at the middle position of the side ofthe separator close to each other, An electric telescopic rod is fixedly connected with the top of the transmission plate between the transmission rollers, an end of the lifting device away from the transmission plate is rotatably connected with the lifting plate, and a fastening device is fixedly connected with the bottom of the lifting plate at a corresponding position of the electric telescopicrod. The invention relates to the technical field of semiconductors and pan-semiconductors. The device can effectively fasten the substrate, avoid surface abrasion in the transfer process, avoid collision, protect the substrate safety, and ensure the processing quality.

Description

technical field [0001] The invention relates to the technical field of semiconductors and pan-semiconductors, in particular to a transport steering device for semiconductors and pan-semiconductor substrates. Background technique [0002] With the vigorous development of my country's semiconductor industry in recent years, project companies rely on the unique local conditions to develop superior resources, dig deep into potentials, and improve the production technology level of project products. This semiconductor wafer and liquid crystal factory construction materials, equipment, and construction industry projects will be Give full play to the advantages of leading technology and talents, improve the technical level through enterprise technological transformation, purchase advanced technical equipment, adopt large-scale production and operation, semiconductor wafer and liquid crystal factory construction materials, equipment, semiconductor and pan-semiconductor automatic handl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/687
CPCH01L21/67718H01L21/68742
Inventor 沈良霖
Owner 浙江雅市晶科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products