Heat-insulation polyphenyl board forming device

Abstract

The invention discloses a heat-insulation polyphenyl board forming device. The heat-insulation polyphenyl board forming device comprises a metal shell. An oil tank is mounted on the upper end face ofthe metal shell. A control panel is mounted on one side of the metal shell. Supporting legs are mounted at the four corners of the bottom surface of the metal shell. Rubber suction cups are mounted atthe bottom ends of the supporting legs. A feeding port is formed in the front end face of the metal shell. A supporting plate is mounted on the front end face of the feeding port. Supporting columnsare mounted on the bottom surface of the front end of the supporting plate. A fixing plate is mounted on the upper end face of the front end of the supporting plate. A disc handle is mounted on the front side of the fixing plate. A sliding plate is mounted on the rear side of the fixing plate. A groove is mounted above the feeding port. A connecting rod is mounted on the front end face of the groove. A handle is mounted on the front end face of the connecting rod. According to the heat-insulation polyphenyl board forming device, punch-formed boards can be cut through a high-temperature cuttingknife, so that the cutting effect is good; and the edges of the boards can be pressed.

Description

technical field [0001] The invention relates to the technical field of production of thermal insulation boards, in particular to a forming device for polystyrene thermal insulation boards. Background technique [0002] With the rapid development of social economy, there are more and more types of panels on the market. Thermal insulation materials are generally light, loose, porous, and fiber materials, which can be divided into organic materials and inorganic materials according to their composition. There are two types. The thermal insulation performance of the former is better than that of the latter, but the durability of the latter is better than that of the former. Thermal conductivity is the main index to measure the performance of thermal insulation materials. The smaller the thermal insulation performance, the better the thermal conductivity of the material depends on the composition, internal structure, bulk density, etc. of the material, and also determines the ave...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a polystyrene thermal insulation board molding device to solve the problem of poor material cutting and burrs in the production of boards during the molding process of the existing thermal insulation board proposed in the above background technology , affect aesthetics and other issues

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