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A method for improving height difference drilling of a soft-hard bonded PCB

A PCB board, soft and hard combination technology, applied in electrical components, printed circuit manufacturing, printed circuits and other directions, can solve problems such as easy generation of burrs, and achieve the effect of controlling costs, suppressing burrs, and improving processing problems.

Inactive Publication Date: 2018-12-11
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for improving the level difference drilling of the rigid-flex PCB board, aiming to solve the problem of drilling the rigid-flex PCB board with the height difference in the prior art. Problems prone to glitches

Method used

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  • A method for improving height difference drilling of a soft-hard bonded PCB
  • A method for improving height difference drilling of a soft-hard bonded PCB
  • A method for improving height difference drilling of a soft-hard bonded PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] According to polyurethane acrylate, acrylic monomer, photoinitiator TPO, talcum powder, polysiloxane and blue toner, mix and stir for 2 hours according to the ratio of 42:13:6:35:3.95:0.05 by weight, and adjust it to 12000CPS The viscosity of the glue solution is different, and the PCB board surface with different height difference is printed with different meshes, and the concave area of ​​the PCB board surface is filled and UV light curing. The intensity of the UV light curing is 900mj / cm 2 , and then carry out the drilling process test with the cover / backing plate. The results of the burr detection are shown in Table 1, and finally the film is removed.

[0049] Table 1 Example 1 burr detection results:

[0050]

[0051] From the above experimental results, it can be seen that the UV light-curable ink prepared in Example 1 selects a suitable screen printing to fill the height difference of the PCB board surface. The film is fast and has no glue residue.

Embodiment 2

[0053] Mix and stir aliphatic acrylate, acrylic acid monomer, photoinitiator 184, fumed silicon, polysiloxane and blue toner for 2 hours according to the ratio of 40:15:10:31:3.9:0.1 by weight, and adjust to Glue viscosity of 14000CPS, use screen printing of different meshes to print PCB boards with different height differences, fill the concave area of ​​PCB board and UV light curing, the intensity of UV light curing is 800mj / cm 2 , and then carry out the drilling process test with the cover / backing plate. The results of the burr detection are shown in Table 2, and finally the film is removed.

[0054] Table 2 Example 2 burr detection results:

[0055]

[0056] From the above experimental results, it can be seen that the UV light-curable ink prepared in Example 2 selects a suitable screen printing to fill the height difference of the PCB board surface, and has excellent drilling processing performance after curing, which can effectively suppress processing burrs and proces...

Embodiment 3

[0058] According to the ratio of polyether acrylate, acrylic acid monomer, photoinitiator TPO, talcum powder, polysiloxane and blue toner according to the weight percentage of 45:10:5:35.5:4.45:0.05, mix and stir for 2h, adjust to Glue viscosity of 10000CPS, use screen printing of different meshes to print PCB boards with different height differences, fill the concave area of ​​PCB board and UV light curing, the intensity of UV light curing is 1000mj / cm 2 , and then carry out the drilling process test with the cover / backing plate. The results of the burr detection are shown in Table 2, and finally the film is removed.

[0059] Table 3 Example 3 burr detection results:

[0060]

[0061] From the above experimental results, it can be seen that the UV light-curable ink prepared in Example 2 selects a suitable screen printing to fill the height difference of the PCB board surface, and has excellent drilling processing performance after curing, which can effectively suppress pro...

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Abstract

The invention discloses a method for improving the height difference drilling of a soft-hard bonded PCB, wherein, the method comprises the following steps: filling and curing the concave area of the area to be drilled of the soft-hard bonded PCB board by using ink; After drilling the soft-hard bonded PCB board filled with the ink and solidified, the ink filled on the surface of the soft-hard bonded PCB board is subjected to film demoulding treatment to obtain the soft-hard bonded PCB board drilled. As that ink is selectively filled in the concave area of the area to be drilled of the PCB board, the cost can be control better than that of the whole board surface coating; And the soft-hard bonded PCB after filling and solidifying ink can effectively restrain burr produced in the drilling process of the soft-hard bonded PCB due to no dead-angle filling of ink and high coating hardness after bonding the cover plate and the pad plate, thereby effectively improving the problem of PCB heightdifference drilling.

Description

technical field [0001] The invention relates to the field of PCB drilling, in particular to a method for improving the level difference drilling of a rigid-flex PCB board. Background technique [0002] Rigid-flex board is a circuit board with FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards through lamination and other processes according to relevant process requirements. The rigid-flex board can be used in some products with special requirements. It has both a certain flexible area and a certain rigid area, which is of great help to save the internal space of the product, reduce the volume of the finished product, and improve the performance of the product. [0003] Rigid-flex board has greatly enriched the design mode of circuit boards and has become one of the mainstreams of PCB development. However, since the rigid-flex board is a combination of a flexible circuit board and a rigid circuit board, there must...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K3/0094H05K2203/166
Inventor 张伦强杨迪李秦洲王建
Owner SHENZHEN NEWCCESS IND
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