Gold plating method for gold fingers and gold finger circuit board

Abstract

The invention provides a gold plating method for gold fingers and a gold finger circuit board. According to the gold plating method, a secondary outer pad is arranged corresponding to a projection position of each gold finger on an outer circuit board on a secondary outer circuit board; each secondary outer pad is electrically connected by adopting an electroplated lead; first blind holes are formed in each gold finger and are filled up through hole-filling electroplating, thereby conducting each gold finger and the corresponding secondary outer pad; the gold fingers are connected with a powersupply for carrying out gold plating; and the electroplated lead connected with each secondary outer pad is finally disconnected through depth-controlled drilling, so that each gold finger is broken,thereby achieving production of the gold fingers free of the electroplated lead on the surfaces. A gold-plated lead is arranged on the secondary outer circuit board and the electroplated lead is notdesigned on the surface of the outer circuit board, so that the scratch probability of the gold fingers in the production process is reduced, the quality of a product is improved, the material cost isreduced, gold permeating on a copper surface is avoided, the dependence on manual repair in the production process is reduced and the defect caused by the electroplated lead on the outer circuit board in the prior art is avoided.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a gold-finger gold-plating method and a gold-finger circuit board. Background technique [0002] In order to meet the development requirements of diversification and portability of electronic products, printed circuit boards not only have high aperture ratio and high-precision features of fine lines, but also high-density circuit board designs such as golden fingers for high-speed communication. In the functional application of electronic products, in order to reduce the loss of signal transmission, high-speed storage products generally need to use circuit boards with gold finger design as the carrier board. Gold finger is composed of many golden-yellow conductive contacts, its surface is plated with anti-oxidation and highly conductive gold, and the conductive contacts are arranged like fingers, so it is called "gold finger". [0003] The commonly used gold fingers are usually des...

AI Technical Summary

Problems solved by technology

[0005] (1) High precision is required for pattern transfer alignment, and it is prone to seepage of gold at the bottom of the gold finger electroplating lead and cannot be completely removed;

[0006] (2) After gold-plating, do solder mask and gold-melt, and the gold-plated gold fingers are easy to scratch, which affects the appearance yield;

[0007] (3) Gold plating is done after gold plating, the dry film has poor film release during the gold plating process, and the gold finger plating leads are gold-plated again, which will cause an increase in material costs;

[0008] (4) Since the gold finger electroplating lead extends to the edge of the board, it is easy to pull up the bottom copper skin during molding and cause burrs around the gold surface. If it is not removed, it will cause scratches between products during handling. Alkaline etching is required to remove burrs. One more production process

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