Device of fast case heat dissipation

Abstract

The invention discloses a device of fast case heat dissipation. The device includes an air inlet, a housing body and heat dissipation conducting devices. The air inlet is disposed at one side of the housing body. A dust filtering net is mounted in a moving manner at one side which is inside the housing body and is adjacent to the air inlet. A fan is mounted at one side which is of the dust filtering net and faces away from the air inlet. A cooling placement main-body is mounted at one side which is of the fan and faces away from the dust filtering net. A hand basket is mounted at one end of the cooling placement main-body. A gas collection cylinder is mounted at one side which is of the hand basket and faces away from the fan. The heat dissipation conducting devices are connected to the gas collection cylinder through rubber hoses. The number of the heat dissipation conducting devices and the number of the rubber hoses are both three. Pipe connectors are mounted at one end which is ofthe heat dissipation conducting devices and is adjacent to the rubber hoses. Disc air taps are mounted at one end which is of the pipe connectors and faces away from the rubber hoses. Temperature probes are mounted at middle ends of one side which is of the disc air taps and faces away from the pipe connectors. The device has the advantages of dustproof filtering, partitioning heat dissipation, fast cooling and the like.

Description

technical field [0001] The invention relates to the technical field of case heat dissipation, in particular to a fast heat dissipation device for a case. Background technique [0002] As a part of computer accessories, the chassis is mainly used to place and fix various computer accessories, and play a role of support and protection. In addition, the computer chassis has an important role in shielding electromagnetic radiation. The existing chassis cooling effect is not very good. Well, it is necessary to use multiple fans to dissipate heat in multiple places. There are problems such as low fan cooling utilization rate, slow fan cooling, and poor temperature control. In order to solve the above problems, a fast cooling device for the chassis is proposed for people to use. . Contents of the invention [0003] The purpose of the present invention is to provide a fast heat dissipation device for a chassis. By setting a fan, cooling and placing the main body, a heat dissipati...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a fast heat dissipation device for the chassis. By setting the fan, cooling and placing the main body, the heat dissipation conduction body and the dust filter, it has the advantages of dust-proof filtration, partition heat dissipation, and rapid cooling. The fan cools down slowly, the temperature is not well controlled, etc.

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