Flexible hinge micro-component bending test device with large range and high precision

Abstract

The invention provides a large-scale and high-precision flexible hinge micro-component bending test device, wherein the loading mechanism is an initial displacement output by a linear motor, and the first-level displacement is output after being reduced by a first-level displacement reduction mechanism, and the second-level displacement is enlarged. The mechanism generates displacement through the first piezoelectric ceramic driver, amplifies the output as a secondary displacement, and accumulates with the primary displacement as the final displacement. The final displacement of the cutter head is the displacement towards the test piece, and is passed through the pressure sensing mechanism. Measure the force on the cutter head when it advances, and read the advance displacement of the cutter head through the grating displacement sensing mechanism; the clamping body of the clamping mechanism is output after amplifying the displacement generated by the second piezoelectric ceramic driver, and then transmitted to the clamping A pair of clamping heads at the output end of the body form a clamp for the specimen. The invention can realize micro-nano-scale precise loading of micro-force and micro-displacement, ensure good guiding during the clamping and bending process, and thus be suitable for testing the mechanical properties of micro-components of various materials.

Description

technical field [0001] The invention relates to a mechanical performance testing device for micro-nano materials in the technical field of thin film materials, more specifically, a flexible hinge micro-component bending testing device with a large range and high precision. Background technique [0002] With the rapid development of micro-electromechanical systems (MEMS) technology, micro-components of various materials are widely used in micro-devices. The size of MEMS micro-components generally ranges from millimeters to microns. Due to factors such as processing technology, size effects, and surface defects, the mechanical properties of materials at the micro-scale and those at the macro-scale may vary greatly. Therefore, the mechanical properties of micro-components are an important theoretical basis for the study of MEMS, and are very important for the reliability design of MEMS devices. Unidirectional bending test is the most direct method to measure parameters such as...

AI Technical Summary

Problems solved by technology

For this reason, the present invention proposes an easy-to-operate, low-cost flexible hinge micro-component bending test device with a large range and high precision, in order to overcome the measurement error caused by the low guiding precision in the existing measurement method and the comparison of the non-contact measurement mechanics. Few deficiencies, realize micro-nano-level precise loading of micro-force and micro-displacement, ensure good guidance in the process of clamping and bending, so as to adapt to the mechanical performance test of micro-components of various materials

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