Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Air knife device for drying substrate

An air knife and substrate technology, which is used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc.

Active Publication Date: 2018-11-20
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above technical problems, an object of the present disclosure is to provide an air knife device for drying substrates, which can accurately detect changes in air volume at various positions of the air knife nozzle assembly by moving the telescopic flap and the moving sensor , timely discover the blockage problem of the air knife nozzle assembly, and prevent the abnormal quality of the substrate product due to the blockage of the air knife nozzle assembly

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Air knife device for drying substrate
  • Air knife device for drying substrate
  • Air knife device for drying substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be exemplified below in detail with reference to the attached drawings. Furthermore, the direction terms mentioned in this disclosure, such as up, down, top, bottom, front, back, left, right, inside, outside, side layer, surrounding, center, horizontal, transverse, vertical, longitudinal, axial , radial direction, the uppermost layer or the lowermost layer, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to explain and understand the present disclosure, but not to limit the present disclosure.

[0021] In the figures, structurally similar units are denoted by the same reference numerals.

[0022] refer to figure 1 and figure 2 , figure 1 A schematic diagram showing the structure of an air knife device according to an embodiment of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an air knife device for drying a substrate. The air knife device comprises an air knife assembly, a movable telescopic baffle piece and a movable sensor. The air knife assemblycomprises an air knife air nozzle assembly, a pipeline connected with the air knife air nozzle assembly, an air supply device connected with the pipeline, and an adjusting device for controlling the wind power intensity of the air knife air nozzle assembly. The air knife air nozzle assembly comprises a first air knife air nozzle and a second air knife air nozzle, wherein the first air knife air nozzle and the second air knife air nozzle are used for blowing the two surfaces of the substrate respectively. The movable telescopic baffle piece is movably and telescopically arranged at the air outlet of the air knife air nozzle assembly. The movable sensor is movably arranged on the movable telescopic baffle piece, so as to detect the air outlet quantity of the air knife air nozzle assembly ata specific position. By virtue of the movable telescopic baffle piece and the movable sensor, the air volume changes of all positions of the air knife air nozzle assembly can be accurately detected, and the blockage problem of the air knife air nozzle assembly can be found in time, so that the phenomenon that the quality of the substrate product is abnormal due to blockage of the air knife air nozzle assembly is avoided.

Description

【Technical field】 [0001] The disclosure relates to an air knife device, in particular to an air knife device for a wet cleaning machine for drying substrates. 【Background technique】 [0002] In the process of manufacturing thin film transistor substrates, it is necessary to use various wet cleaning machines for cleaning, etching, developing and other processes. The process flow of these wet cleaning machines often has different cleaning processes depending on the process. The general cleaning process includes, for example, extreme ultraviolet (EUV) dry cleaning, chemical wet cleaning, brush cleaning, two-fluid water cleaning, Air knife drying etc. After the substrate is cleaned with liquid medicine and water, a large amount of water usually remains on the surface of the substrate. Before entering the next process, it needs to be dried by an air knife device to remove the water on the surface of the substrate, so as to avoid water remaining on the surface of the substrate an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67034
Inventor 刘思洋
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com