Light-emitting diode epitaxial wafer and preparation method thereof
A technology for light-emitting diodes and epitaxial wafers, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low luminous efficiency of light-emitting diodes, and achieve the effects of increasing recombination efficiency, increasing luminous efficiency, and increasing the number of holes
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[0031] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0032] figure 1 It is a structural diagram of a light-emitting diode epitaxial wafer provided by an embodiment of the present invention. Such as figure 1 As shown, the epitaxial wafer includes a substrate 1 and a low-temperature GaN buffer layer 2 , an undoped GaN layer 3 , an N-type GaN layer 4 , an active layer 5 and a P-type GaN layer 6 sequentially stacked on the substrate 1 .
[0033] The active layer 5 includes a first barrier layer 51 and a plurality of well layers 521, the first barrier layer 51 includes a plurality of first sub-barrier layers 511, the first sub-barrier layers 511 and the well layers 521 are alternately stacked, and the well layers 521 are InGaN well layer, the first sub-barrier layer 511 includes GaN / In x G...
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