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Heat sink device cooling channel generation type design method based on element-free Galerkin method

A technology of heat-dissipating components and Galerkin method is applied in the field of topology optimization design of cooling channels of heat-dissipating components.

Active Publication Date: 2018-11-13
XI AN JIAOTONG UNIV
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  • Abstract
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  • Application Information

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Problems solved by technology

Traditionally, the method of finite element analysis is used to design and optimize the layout of high thermal conductivity auxiliary materials. Due to the constraints of finite element grids, the optimization design process of auxiliary materials often cannot be optimized in the 360° global range, which limits the Obtain the optimal auxiliary material layout

Method used

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  • Heat sink device cooling channel generation type design method based on element-free Galerkin method
  • Heat sink device cooling channel generation type design method based on element-free Galerkin method
  • Heat sink device cooling channel generation type design method based on element-free Galerkin method

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Embodiment 1

[0049] In a given 40mm x 40mm design domain base material, 81x81 evenly distributed nodes are arranged first. There are evenly distributed heat sources in the body, the four sides are insulated, and there is only one heat dissipation point at the midpoint of one side, and the temperature is 0°C. Given that the thermal conductivity of the base material is 0.01W / (m K), set each growth distance to 0.5mm; take the heat sink as the seed point, conduct a 360° range of optimization, and find the heat transfer potential capacity dissipation Minimal growth angle. And add it as a node at the end position, and set its thermal conductivity to 1W / (m·K). After that, use this node as a new seed point to continue growing. If the difference between the two growth angles before and after is greater than 90°, it is considered that the modified point has the ability to diverge, and the growth of main branches and side branches is carried out at the same time. If the growth reaches the boundary...

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Abstract

The invention discloses a heat sink device cooling channel generation type design method based on an element-free Galerkin method. Discretization is carried out on a design domain by the adoption of aGalerkin computing node; an auxiliary material of a cooling channel is generated from a channel outlet in a design process, and a newly generated auxiliary material node can be optimized in a 360-degree full-domain space without restrictions and limitations of the computing node of a base material of the design domain; and divergence points and a divergence direction are automatically judged in an auxiliary material generation design process, and autonomous generation design of a main branch and side branches is achieved. According to the method, through element-free Galerkin discretization processing, the auxiliary material generating node of the cooling channel can be optimized in a 360-degree full-domain range, and a problem of re-dividing and computing grids is avoided.

Description

technical field [0001] The invention relates to a topology optimization design method for a cooling channel of a heat dissipation device, in particular to a generative design method for a cooling channel of a heat dissipation device based on the gridless Galerkin method. Background technique [0002] Electronic components are accelerating towards ultra-high power, high integration, large-scale and miniaturization, followed by increasingly severe heat dissipation and cooling problems; while the traditional forced convection heat transfer method It has been unable to meet the heat dissipation and cooling requirements of ultra-high-power electronic components; however, by designing and arranging auxiliary materials with high thermal conductivity or cooling channels with better heat transfer performance inside the heat dissipation device, efficient heat dissipation and cooling channels are constructed to achieve The efficient transmission of heat can effectively solve the curren...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/23
Inventor 林起崟王继红洪军刘正李宝童郑帅
Owner XI AN JIAOTONG UNIV
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