Computer mainframe case

A main chassis and computer technology, applied in the computer field, can solve problems such as chassis damage, short service life of the host, and vibration of the motherboard, and achieve the effects of preventing water ingress and increasing heat dissipation performance.

Active Publication Date: 2018-11-13
义乌市嘉诗电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The host computer is the core component of the computer. The chassis includes the chassis shell and the motherboard installed inside the chassis shell. The motherboard is fixed and installed inside the chassis shell by screws. The host computer is placed on the ground when in use. There is water, vibration or hot and dry environment, and the service life of the host is often short when used
In order to increase the anti-seismic ability of the main unit, a buffer and shock-absorbing structure is generally installed at the bottom of the main unit, but no matter how it is set, in the face of large vibrations, it will cause the internal main board to vibrate, which will cause the components on the main board to loosen. Chassis damage
Faced with the use in the mobile environment, the use requirements of the chassis obviously cannot meet

Method used

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Examples

Experimental program
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Embodiment Construction

[0020] Such as figure 1 As shown, the computer main frame includes a main frame 12, and a rubber air-absorbing layer 5 is respectively embedded in both sides of the main frame 12. On both sides of the chassis host 12, a bending part 1 is arranged on both sides of the top of the chassis host 12; a top plate 2 is arranged on the top of the chassis host 12, and the chassis host 12 is fixed on the bottom of the top plate 2 by screws on the bending part 1;

[0021] Both sides of the top plate 2 protrude from both sides of the chassis main body 12, and a rotating cavity is respectively provided on both sides of the extending end, and a supporting plate 4 is installed in the rotating cavity, and a rotating shaft 11 is respectively arranged on both sides of the supporting plate 4, A rotating shaft hole is provided on both sides of the inner wall of the rotating cavity, and the supporting plate 4 is installed in the rotating shaft hole by rotating the rotating shaft 11 on both sides. ...

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PUM

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Abstract

The invention discloses a computer mainframe case. The computer mainframe case comprises a case host, rubber air suction layers are embedded in the two sides of the case host respectively, the inner ends of the rubber air suction layers extend into the case host, the outer ends of the case host protrude out of the two sides of the case host, and the two sides of the top of the case host are both provided with a bent part; a top plate is arranged at the top of the case host, and the case host is fixedly arranged at the bottom of the top plate through screws on the bent parts; the two sides of the top plate extend out of the two sides of the case host, and two sides of each extending end of the top plate are both provided with a rotating cavity; supporting plates are arranged in the rotatingcavities, and rotating shafts are arranged on the two sides of each supporting plate; rotating shaft holes are formed in the two sides of the inner wall of each rotating cavity respectively. The casehost adopts a suspension mode so that the host cannot be in contact with the ground, and very good building and waterproof effects are achieved. The computer mainframe case is particularly suitable for being applied to a mobile environment; efficient heat dissipation and stable use can be realized by utilizing vibration force in the mobile environment.

Description

technical field [0001] The invention relates to the field of computers, in particular to a main computer box. Background technique [0002] The host computer is the core component of the computer. The chassis includes the chassis shell and the motherboard installed inside the chassis shell. The motherboard is fixed and installed inside the chassis shell by screws. The host computer is placed on the ground when in use. There is water, vibration or hot and dry environment, and the host often has a short service life when it is used. In order to increase the anti-seismic ability of the main unit, a buffer and shock-absorbing structure is generally installed at the bottom of the main unit, but no matter how it is set, in the face of large vibrations, it will cause the internal main board to vibrate, which will cause the components on the main board to loosen. Damage to the chassis. Faced with the use in a mobile environment, the use requirements of the chassis obviously cannot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/182G06F1/20
Inventor 蒋莲莲
Owner 义乌市嘉诗电子科技有限公司
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