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Leveling mechanism of wafer bracket, wafer lifting mechanism and reaction chamber

A technology of wafer bracket and leveling mechanism, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as complicated process, small adjustable range, and limited adjustment amount, so as to simplify the leveling process and improve Process efficiency, the effect of increasing the adjustable range

Inactive Publication Date: 2018-10-23
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] It is not difficult to see that although the above-mentioned leveling mechanism can achieve the leveling function, the process is complicated, time-consuming and labor-intensive, and affects the overall energy efficiency of the machine. Moreover, the eight bolts also form mutual constraints while cooperating with each other for leveling, thus The amount of adjustment is limited, and the adjustable range is small

Method used

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  • Leveling mechanism of wafer bracket, wafer lifting mechanism and reaction chamber
  • Leveling mechanism of wafer bracket, wafer lifting mechanism and reaction chamber
  • Leveling mechanism of wafer bracket, wafer lifting mechanism and reaction chamber

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Embodiment Construction

[0027] In order for those skilled in the art to better understand the technical solution of the present invention, the leveling mechanism of the wafer carrier, the wafer lifting mechanism and the reaction chamber provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0028] Please also refer to Figure 3 ~ Figure 6 , the wafer lifting mechanism provided by the embodiment of the present invention includes a wafer carrier 500 , a lifting shaft 600 and a driving source 700 . Wherein, the lifting shaft 600 is arranged vertically, and the lower end of the lifting shaft 600 is connected with the driving source 700 , and the upper end of the lifting shaft 600 is connected with the wafer carrier 500 through the leveling mechanism 800 . Driven by the driving source 700, the lifting shaft 600 drives the wafer carrier 500 to move up and down, so as to cooperate with the manipulator to complete the wafer pickup or placement. The...

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Abstract

The invention provides the leveling mechanism of a wafer bracket, a wafer lifting mechanism and a reaction chamber. The leveling mechanism comprises at least three leveling bolts and a support positioning component. The at least three leveling bolts are symmetrically distributed around the support positioning component. Each leveling bolt penetrates the wafer bracket and is connected to a liftingshaft in a threaded connection mode. The support positioning component and the wafer bracket are fixedly connected. A spherical concave portion forms on the upper end surface of the lifting shaft. Thesupport positioning component comprises a spherical convex portion. The spherical concave portion and the spherical convex portion are cooperated. By using the leveling mechanism of the wafer bracket, only the at least three leveling bolts need to be adjusted so that leveling can be completed, a leveling process can be simplified and technology efficiency is increased. The setting of the supportpositioning component does not affect the adjusting amount of leveling bolts so that an adjustable range can be increased.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a leveling mechanism of a wafer carrier, a wafer lifting mechanism and a reaction chamber. Background technique [0002] In the field of integrated circuit manufacturing, many devices need to use the lifting motion of the wafer lifting mechanism to cooperate with the manipulator to complete the wafer (Wafer) pick-up or release before the process is performed. The wafer lifting mechanism usually consists of a wafer carrier for carrying wafers, an air cylinder and a lifting shaft connecting the two, and the wafer carrier and the lifting shaft are connected by an adjustment mechanism, and the adjustment mechanism can adjust the carrying surface of the wafer carrier levelness to ensure the stability of the wafer during the process. [0003] figure 1 It is a structural diagram of an existing wafer lifting mechanism. see figure 1 , the wafer lifting mechanism in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCH01L21/68742H01L21/6875
Inventor 史全宇
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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