A kind of gas discharge reactor, gas discharge system and preparation method of trichlorosilane

A gas discharge and reactor technology, applied in chemical instruments and methods, chemical/physical/physical-chemical processes of applying energy, silicon compounds, etc. The effect of low loss and low energy consumption

Active Publication Date: 2020-06-02
ASIA SILICON QINGHAI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Existing gas discharge reactors use a single-layer dielectric, and the exposed electrodes will sputter metal particles during the discharge process, which will pollute the discharge gas, affect product quality, and make product separation difficult

Method used

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  • A kind of gas discharge reactor, gas discharge system and preparation method of trichlorosilane
  • A kind of gas discharge reactor, gas discharge system and preparation method of trichlorosilane

Examples

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Embodiment

[0035] see figure 1 , a gas discharge reactor 100 includes an inner electrode 110, an outer electrode 120, a first dielectric 130 and a second dielectric 140, the outer electrode 120 is arranged outside the inner electrode 110, the second dielectric 140 is arranged in the outer electrode 120, the first The dielectric 130 is arranged between the inner electrode 110 and the outer electrode 120, a rare gas discharge chamber 150 is formed between the inner electrode 110 and the first dielectric 130, and a material gas discharge chamber 160 is formed between the first dielectric 130 and the outer electrode 120, The gas discharge reactor 100 has a material gas inlet 161 and a material gas outlet 162 . Both the material gas inlet 161 and the material gas outlet 162 are arranged on the outer electrode 120 and communicate with the material gas discharge chamber 160 .

[0036] During use, the rare gas passes through the rare gas discharge chamber 150, and the material gas passes through...

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Abstract

The invention provides a gas discharge reactor, a gas discharge system, and a preparation method of trichlorosilane, and belongs to the technical field of polycrystalline silicon production. The gas discharge reactor includes an inner electrode, an outer electrode, a first dielectric medium and a second dielectric medium, wherein the outer electrode is arranged outside the inner electrode; the second dielectric medium is disposed in the outer electrode; the first dielectric medium is located between the inner electrode and the outer electrode; a rare gas discharge chamber is formed between theinner electrode and the first dielectric medium; a material gas discharge chamber is formed between the first dielectric medium and the outer electrode; the gas discharge reactor has a material gas inlet and a material gas outlet, which are both disposed on the outer electrode and communicated with the material gas discharge chamber. The gas discharge reactor with the gas discharge system is employed in the preparation method of trichlorosilane, in which the material gas is separated from the rare gas, so that the rare gas can be recycled and pollution on the trichlorosilane can be avoided.

Description

technical field [0001] The invention relates to the technical field of polysilicon production, in particular to a gas discharge reactor, a gas discharge system and a method for preparing trichlorosilane. Background technique [0002] At present, the modified Siemens method is the mainstream technology for producing polysilicon, and more than 95% of the polysilicon in the market is produced by the modified Siemens method. According to statistics, when the improved Siemens method is used to produce polysilicon, about 16 tons of silicon tetrachloride will be produced for every ton of polysilicon produced. The hydrogenation of silicon tetrachloride to prepare trichlorosilane is the key to ensure the improved closed-circuit cycle of the Siemens process, and the realization of low-pollution hydrogenation of silicon tetrachloride to prepare high-purity trichlorosilane is an inevitable requirement for the production of high-purity polysilicon. [0003] At present, polysilicon facto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J19/08C01B33/107
CPCB01J19/088C01B33/1071
Inventor 张宝顺宗冰肖建忠王体虎陈聪
Owner ASIA SILICON QINGHAI
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