Production process of semiconductor diode

Abstract

The invention belongs to the technical field of semiconductor diode manufacturing, and particularly relates to a production process of a semiconductor diode. The process comprises the following stepsthat a chip and a lead of the semiconductor diode are installed into a graphite boat, the graphite boat is fed into a welding furnace, and the chip of the semiconductor diode is connected with the metal lead; the welded semiconductor diode is placed in an acid pickling machine for acid pickling; the semiconductor diode subjected to acid pickling is dried after being cleaned, and the semiconductordiode is placed into a dispensing machine for dispensing drying; the semiconductor diode obtained after dispensing drying is placed into a pin forming device to be formed; and the formed semiconductordiode is subjected to surface treatment, and after testing, finish product packaging is carried out. According to the production process, bending modules are hinged to the two sides of the top of a lower mold, and the bending modules swing around the hinged portions when the lower mold moves downwards to achieve pin bending; and a dust removal module is arranged on the non-hinged side of each bending module, and dust in first locating grooves of the bending modules is removed.

Description

technical field [0001] The invention belongs to the technical field of semiconductor diode manufacturing, in particular to a semiconductor diode production process. Background technique [0002] Diode bending foot forming process is already a relatively mature process in the market, and there are also various automation equipment, which can solve the forming process of product diversification. But the disadvantages are also obvious. It is suitable for products with large quantities and few varieties, and it must be a braided product. There are also limitations on the thickness of the pins, and it cannot be popularized to all products. And the equipment cost is also high, it is impossible to standardize and automate the production of all products used. Usually, for small-batch products and repairs and supplements, most of them are carried out by manual bending. This method is difficult to guarantee dimensional accuracy, affects product quality, and is inefficient and labor-i...

AI Technical Summary

Problems solved by technology

However, in this solution, the pins rub against the lower mold during bending, which leads to scratches on the pins, which in turn leads to quality problems; the bending angle of the pins cannot be adjusted, and the bending fillet of the pins cannot be adjusted, which leads to the inapplicability of the product. Low stability; the dust in the positioning groove cannot be cleaned in time after bending

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