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Temperature compensation method for damage monitoring of electromechanical impedance structure

A technology of temperature compensation and electromechanical impedance, applied in the direction of material impedance, etc., to reduce the impact, improve the accuracy, and avoid the impact.

Inactive Publication Date: 2018-10-16
BEIJING UNIV OF TECH
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  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to design and propose a kind of effective quantitative temperature compensation algorithm based on minimum RMSD to eliminate the impact of environmental temperature on monitoring results in the monitoring process, aiming at the situation that the structural health monitoring technology based on electromechanical impedance method is easily disturbed by environmental temperature factors. Impact

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  • Temperature compensation method for damage monitoring of electromechanical impedance structure
  • Temperature compensation method for damage monitoring of electromechanical impedance structure
  • Temperature compensation method for damage monitoring of electromechanical impedance structure

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Embodiment Construction

[0019] In order to make the technical solutions and advantages of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the drawings in the embodiments of the present invention:

[0020] The invention proposes an effective quantitative temperature compensation method for monitoring the structural damage of electromechanical impedance. Firstly, the structural health monitoring system based on the electromechanical impedance method is used to collect and analyze the impedance signal of the tested object. Taking the aluminum alloy beam structure as an example, the influence of temperature change on the impedance signal of the aluminum beam is studied. It was found that both the real part and the imaginary part of the impedance spectrum of the tested piece drifted in a certain direction with the change of temperature. Through calculation, curve fitting is carried out on t...

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Abstract

The invention discloses a temperature compensation method for the damage monitoring of an electromechanical impedance structure. The method comprises the following steps: the impedance (admittance) signal of a detected test piece is measured and analyzed to study influence of temperature change on the impedance signal; the real part and the imaginary part of the impedance spectrum of the measuredstructure drift in a certain direction with the change of the temperature; a reference signal is compensated by a temperature compensation algorithm based on minimum RMSD, and the frequency and the amplitude compensation quantity of a reference signal are curve-fitted to obtain a relationship between the temperature and two compensation quantities, that is, a reference signal temperature compensation quantity fitting curve; and using the reference signal temperature compensation quantity fitting curve to compensate different temperature monitoring signals. The effective quantitative temperature compensation algorithm based on the electromechanical impedance technology can compensate the damage impedance (admittance) signal in any experimental temperature range, so the accuracy of damage location and quantification based on the electromechanical impedance technology in structural health monitoring is improved.

Description

technical field [0001] The invention relates to a temperature compensation method for damage monitoring of electromechanical impedance structures, and belongs to the technical fields of nondestructive testing technology and structural health monitoring. Background technique [0002] With the continuous development of science, technology and industry, various materials are more and more widely used in engineering structures, mechanical structures are becoming more and more complex, and equipment functions are becoming more and more perfect. At the same time, the requirements for materials and structures are also increasing. higher. Structural health monitoring is a very active research field in mechanical and structural engineering, and the research in this field has a wide and far-reaching engineering background. Once the material is damaged, the structural health is compromised. The decline of the bearing capacity of the structure during the service period is defined as t...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/02
CPCG01N27/02
Inventor 刘增华郑嘉裕曹瑾瑾何存富吴斌
Owner BEIJING UNIV OF TECH
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