Board segmentation jig, board segmentation equipment and board segmentation method of circuit board

A circuit board and board splitting technology, which is applied in metal processing and other directions, can solve the problems of affecting the efficiency of circuit board splitting, the inability to realize fully automatic splitting of circuit boards, and low precision of splitting, so as to improve production efficiency and reduce strength , The effect of reducing production errors

Inactive Publication Date: 2018-10-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the related art, when dividing the circuit board, the operator needs to complete a series of operations, resulting in low precision of dividing the board, and it is impossible to realize the fully automatic dividing of the circuit board, thus affecting the division of the circuit board efficiency

Method used

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  • Board segmentation jig, board segmentation equipment and board segmentation method of circuit board
  • Board segmentation jig, board segmentation equipment and board segmentation method of circuit board
  • Board segmentation jig, board segmentation equipment and board segmentation method of circuit board

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Embodiment Construction

[0022] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application.

[0023] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "inner", "outer" etc. Orientation or positional relationship is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construe...

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Abstract

The invention discloses a board segmentation jig, board segmentation equipment and a board segmentation method of a circuit board. The circuit board comprises multiple subsidiary boards. Connecting ribs are connected between every two adjacent subsidiary boards. The board segmentation jig is suitable for segmenting the multiple subsidiary boards of the circuit board. The board segmentation jig comprises a first base plate and a second base plate, wherein the first base plate is provided with a storing groove, the interior of the storing groove is suitable for storing the circuit board, the second base plate and the first base plate are arranged in a stacked manner, the second base plate is provided with a penetration hole, and when the first base plate and the second base plate are stacked, the connecting ribs are opposite to the penetration hole. According to the board segmentation jig, the first base plate and the second base plate have a limiting effect on the circuit board, the cutting technology is adopted, and by means of penetration to the penetration hole of the second base plate, precise cutting of the connecting ribs can be achieved. In addition, in the circuit board cutting process, the circuit board can be produced and cut without manual operation and control, thus, intensity of manual operation is reduced, the production error is reduced, and the production efficiency is improved.

Description

technical field [0001] The present application relates to the technical field of electronic devices, in particular to a board splitting jig, board splitting equipment, and a board splitting method for circuit boards. Background technique [0002] The production and assembly of circuit boards tend to be more and more modular, high-density and three-dimensional assembly. At the same time, the requirements for the compactness of the layout of PCB (Printed Circuit Board, printed circuit board) components are getting higher and higher, resulting in PCB single board The area is getting smaller and smaller, which means that the precision requirements for circuit board cutting and sub-board are getting higher and higher. [0003] In the related art, when dividing the circuit board, the operator needs to complete a series of operations, resulting in low precision of dividing the board, and it is impossible to realize the fully automatic dividing of the circuit board, thus affecting t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D7/01B26D7/00
CPCB26D7/01B26D7/0006
Inventor 覃华平郭雄武
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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