A thermal expansion coefficient measurement device based on engineering thermophysics

Abstract

The invention discloses a thermal expansion coefficient measuring device based on engineering thermophysics. The thermal expansion coefficient measuring device comprises a support base, wherein a measuring shell is mounted at the top of the support base; a front transparent glass layer and a rear transparent glass layer are respectively arranged at the front end and the rear end of the measuring shell; a uniform heating mechanism is arranged inside the measuring shell; the uniform heating mechanism comprises heat conduction blocks which are arranged inside the measuring shell and are uniformlydistributed; holding cavities are formed inside the heat conduction blocks; electric heating plates are arranged inside the holding cavities; thermal expansion coefficient measuring mechanisms are arranged inside adjacent heat conduction blocks; a gantry is arranged outside the measuring shell; an adjusting photographing mechanism is arranged on the gantry. By adopting the thermal expansion coefficient measuring device, measurement of an object to be measured can be prevented from being affected by a measuring structure, meanwhile, temperatures inside the device can be uniformly distributed,the precision of measurement results can be ensured, in addition, thermal expansion coefficients of multiple objects can be simultaneously measured, multiple times of measurement can be carried out toobtain an average value, and thermal expansion coefficients of multiple objects can be simultaneously measured.

Description

technical field [0001] The invention relates to the field of engineering physics, in particular to a thermal expansion coefficient measuring device based on engineering thermophysics. Background technique [0002] Engineering physics is a combination of the three disciplines of physics, engineering and mathematics. The combination of basic physics with the problems to be solved and engineering techniques makes engineering physics have a wide range of applications. This interdisciplinary subject is set up for continuous invention in the field of technology. Unlike traditional engineering disciplines, engineering science / physics does not need to be limited to a branch of science or physics. And engineering science / physics refers to a specialization such as optics, quantum physics, materials science, applied physics, nanotechnology, micromanufacturing, mechanical engineering, electrical engineering, biophysics, control theory, aerodynamics, energy, solid state Physics, etc. p...

AI Technical Summary

Problems solved by technology

[0009] (1) Due to the long size of the ejector rod and the holder, it is difficult to offset the expansion between the ejector rod and the holder during measurement, so that the measurement accuracy of the thermal expansion coefficient of the object to be measured is not high;

[0010] (2) The device for measuring the thermal expansion coefficient is generally long, which makes it difficult to ensure the uniform temperature in the device during measurement, which will have a certain impact on the measurement of the thermal expansion coefficient of the object to be measured;

[0011] (3) The existing thermal expansion coefficient measuring device can generally only measure one object at the same time, neither can measure the thermal expansion coefficient of multiple objects at the same time, nor can it quickly complete multiple measurements of the same object with the same size and take the average

Images