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A preparation method and cleaning solution for an array substrate

An array substrate and cleaning solution technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of difficulty in removing copper-BTA, affecting the electrical properties of display devices, and affecting the stability of display devices.

Active Publication Date: 2020-09-04
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper-BTA is difficult to remove, and its residue will have a greater impact on the stability of the display device, especially when the channel of the conductive pattern on the substrate of the display device (such as the channel between the source and drain) When there are Cu particles remaining in the channel, the copper-BTA will also adhere to the Cu particles in the trench after being treated with the photoresist stripping solution of the Cu process (such as figure 1 shown), which greatly affects the electrical properties of the display device

Method used

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  • A preparation method and cleaning solution for an array substrate
  • A preparation method and cleaning solution for an array substrate
  • A preparation method and cleaning solution for an array substrate

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Embodiment Construction

[0031] see figure 1 , figure 1 It is a schematic structural diagram of the array substrate before and after stripping with a photoresist stripping solution in the copper manufacturing process in the prior art. figure 1 Middle (B) to figure 1 The photoresist pattern layer 40 in (A) is a mask, and the initial copper film 30 has been etched (for example, using H 2 o 2 After performing wet etching), a metal copper pattern layer 30 is obtained, which may specifically be a source electrode and a drain electrode. figure 1 Middle (C) is right figure 1 In (B) the semiconductor layer 20 in the channel of the substrate is dry-etched to thin the semiconductor layer 20, leaving only the regions that can be in contact with the source and drain, which can be called the source contact region and the drain respectively. pole contact area. However, it should be noted that when the semiconductor layer 20 is dry etched, the etching gas used in the dry etching will bombard the metal copper p...

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Abstract

The invention provides a cleaning solution. The cleaning solution is used for cleaning a passivation film including a copper-benzotriazole complex on an array substrate. The cleaning solution comprises water, inorganic base, organic amine and a copper chelating agent. The pH of the cleaning solution is 10 to 11. The chelation ability of the copper chelating agent with copper is greater than the chelating ability of benzotriazole with copper, and a water-soluble complex is generated. The organic amine is used for breaking a coordination bond in the copper-benzotriazole complex and dissolving benzotriazole. The cleaning solution is mainly used for cleaning the array substrate after a photoresist pattern layer is peeled off by a photoresist peeling solution containing benzotriazole. The invention further provides the application of the cleaning solution in the preparation of the array substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing an array substrate and a cleaning solution. Background technique [0002] Thin Film Transistor Liquid Crystal Display (TFT-LCD for short) has the characteristics of small size, low power consumption, and no radiation, and occupies a dominant position in the current flat panel display market. With the continuous development of TFT-LCD, the requirements for resistance and electron mobility are getting higher and higher. In order to make TFT-LCD have higher contrast and image display quality, metal copper with low resistance is usually used as the source and drain electrodes. Conductive materials for conductive patterns such as source electrodes, gate lines, and data lines. That is, the copper process (depositing a metal copper film and then etching it into a desired pattern) is becoming popular in the field of TFT-LCD. [0003] At present, benzotriazole (B...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/84
CPCH01L21/02068H01L27/1288H01L27/1296
Inventor 刘三泓
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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