COB substrate

A substrate and main substrate technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing raw material costs, many right angles and gaps, complex substrate technology, etc., to improve production efficiency, reduce the number of processes, and the process is simple and fast Effect

Pending Publication Date: 2018-09-21
GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of connecting method will cause waste of material area in each row of gaps, which increases the raw material cost of the enterprise; and this kind of connecting method has many right angles and gaps, the process of substrate manufacturing is complicated, and the production efficiency is low.

Method used

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Examples

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Embodiment Construction

[0022] Hereinafter, the present invention will be further described with reference to the drawings and specific implementations. It should be noted that, provided that there is no conflict, the following embodiments or technical features can be combined to form new embodiments. .

[0023] In this application, unless otherwise specified, the words "upper", "lower", "left", "right" and other words that have orientation indications should be understood as orientation indications for the drawings, and the stated "first" "Second" and "Second" should be understood as distinguishing the same or similar parts, and should not be understood as a sequence or primary-secondary relationship.

[0024] The present invention provides a COB substrate, such as figure 2 As shown, it includes a main substrate 1, a plurality of first monoliths 2 and a plurality of second monoliths 3; the shape and size of the first monolith 2 and the second monolith 3 match;

[0025] Such as image 3 As shown, the firs...

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PUM

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Abstract

The invention discloses a COB substrate comprising a main substrate, a plurality of first single patches and a plurality of second single patches. The first single patches and the second single patches are matched in shapes and sizes. The opposite corners of each first single patch are provided with gaps. The opposite corners of each second single patch are provided with gaps. The first single patches and the second single patches are spliced on the main substrate in such a way that the first single patches and the second single patches are arranged alternately in a matrix and the gaps are connected to each other. The COB substrate effectively utilizes the inner area of the main substrate, improves light source packaging efficiency, improves a production process, and improves production efficiency.

Description

Technical field [0001] The present invention relates to the field of COB technology, in particular to a COB substrate. Background technique [0002] COB light source is composed of LED monolithic, fluorescent glue, dam and substrate. Because of its energy saving, environmental protection, long service life and other characteristics, it has been more and more widely used in the lighting industry. In order to better fix the light source, many COB light source substrates are provided with gaps on the diagonal for positioning and to facilitate the assembly of various LED lamp structures. [0003] The COB substrate is usually a combination of multiple substrates (N rows×M rows). For the convenience of COB substrate manufacturers, there will be a gap of about 2mm between rows, such as figure 1 . This type of concatenation will waste the material area of ​​each column and increase the raw material cost of the enterprise; and this concatenation method has many right angles and gaps, the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/48H01L33/62
Inventor 温文丽肖浩苏佳槟
Owner GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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