Plastic sucking moulding process for damping insole

A blister molding and process technology, which is applied in the field of shoe midsole molding, can solve the problems of increased enterprise cost, inability to fine-tune realization, limited processing efficiency, etc., and achieve the effect of improving molding efficiency.

Inactive Publication Date: 2018-09-18
FUJIAN XINGXUN NEW MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The second method adopts a molding method different from the first method, and because people can directly see the granular ETPU particles in appearance, it is very popular with consumers at present, but the second method is currently being used For ETPU particles, the plastic body is usually formed by blow molding process, and then the blow molding mouth is used to fill the cavity with ETPU foam particles until it is full and can no longer be filled, and then the fusing method is used to form a fuse. The head seals the blow molding port. The processing efficiency of this molding method is very limited, which limits the competitiveness of the entire shock-absorbing midsole in industrialization, and because its molding method is very different from the first molding method , cannot be fine-tuned on the original equipment, which increases the cost of the enterprise

Method used

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  • Plastic sucking moulding process for damping insole
  • Plastic sucking moulding process for damping insole

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Embodiment Construction

[0029] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.

[0030] Such as figure 2 Shown, it is a kind of shock-absorbing midsole blister forming process that the present invention relates to, comprises the following steps:

[0031] ①Using TPU material with a Shore hardness of 55A-75A to process into a TPU film 21 with a thickness of 1.0mm-4.0mm;

[0032] ②The TPU film 21 is heated and softened, placed in a blister machine for blister molding, and then shaped to obtain a TPU container 22 with a bottom wall 221 and a side wall 222 after cooling, the TPU container 22 has an upper opening, and the bottom wall 221 and the side wall 222 form a cavity 223;

[0033] 3. Fill up the ETPU particles 23 in the cavity 223 of the TPU container 22;

[0034] ④ Use a layer of TPU film 24 with a thickness of 0.03mm-0.1mm to cover the upper opening 224 of the TPU container 22 and con...

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Abstract

The invention discloses a plastic sucking moulding process for a damping insole, the plastic sucking moulding process comprises the following steps: 1, processing a TPU film with a thickness of 1.0 mmto 4.0 mm from a TPU material having a Shore hardness of 55 A to 75 A; 2, heating and softening the TPU film, placing the TPU film in a plastic sucking machine for plastic sucking moulding, cooling and shaping to obtain a TPU container having a bottom wall and a side wall, wherein the TPU container has an upper opening, and the bottom wall and the side wall form a cavity; 3, fully adding ETPU particles into the cavity of the TPU container; and 4, covering the upper opening of the TPU container with the TPU film with a thickness of 0.03 mm to 0.1 mm, and connecting the TPU film with the side wall of the TPU container to form the damping insole. Compared with the prior art, the plastic sucking moulding process is applied to the field of shoemaking, and greatly improves the forming efficiency.

Description

technical field [0001] The invention relates to the field of shoe midsole molding, in particular to a shock-absorbing midsole molding process, which has the characteristics of easy industrialization and high molding efficiency. Background technique [0002] At present, with the continuous development of science and technology, foamed thermoplastic polyurethane (ETPU) is used more and more in shoe materials. There are generally two ways to apply foamed thermoplastic polyurethane in the market as the midsole material of shock-absorbing shoes: [0003] The first way is to put the ETPU particles into the molding mold first, and then use steam to heat for secondary foaming, so that adjacent ETPU particles can fuse with each other, and then get the ETPU sole after cooling, such as figure 1 Shown, it is the mold 10 that adopts when utilizing steam foam molding, has upper mold 11, lower mold 12 and the mold cavity 13 that is formed between upper mold 11 and lower mold 12, utilizes t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29D35/12
Inventor 张小海
Owner FUJIAN XINGXUN NEW MATERIALS TECH CO LTD
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