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Multilayer flexible circuit board for tablet

A flexible circuit board and flat panel technology, which is applied in the direction of printed circuit, circuit heating device, printed circuit components, etc., can solve the problems that the heat cannot be dissipated in time, the utilization rate of the inner circuit board is low, and there is no buffer material, etc. Achieve the effects of improving connection convenience, saving internal space, and providing vibration cushioning

Pending Publication Date: 2018-09-07
扬州市玄裕电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production of multi-layer flexible circuit boards is based on the basic process of making single-sided and double-sided FPC boards, increasing the superposition between layers and realizing the conduction between layers, etc. The multi-layer flexible circuit board is generally connected to the outermost circuit through the via hole, and the outermost circuit board is connected to other external components through gold fingers or pads. The utilization rate of the inner layer circuit board is low, and the outer layer There is no corresponding buffer material between the circuit board and the inner circuit board, and the heat emitted by the outer circuit board and the inner circuit board cannot be dissipated in time. Therefore, we propose a multi-layer flexible circuit for flat panels plate

Method used

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  • Multilayer flexible circuit board for tablet

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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] see figure 1 , the present invention provides a technical solution: a multi-layer flexible circuit board for a flat panel, including a protection board 1, a mounting hole 2 is opened on the left side of the protection board 1, and a mounting hole 2 is provided on the right side of the protection board 1 to match the installation hole 2 The plug-in column 3, the protective plate 1 includes the outer plate base material layer 4, the outer circuit board 5 ...

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Abstract

The invention discloses a multilayer flexible circuit board for a tablet, and belongs to the technical field of flexible circuit boards. The multilayer flexible circuit board comprises a protection board, wherein a left side of the protection board is provided with a mounting hole; a right side of the protection board is provided with a plugin column which is matched with the mounting hole; the protection board comprises an outer board substrate layer; one side opposite to the outer board substrate layer is provided with an outer circuit board; the inner cavities of a semi-cured layer and an inner board substrate layer are provided with insulating support blocks; the insulating support blocks are embedded between the outer circuit board and the inner circuit board; one side far away from acircuit connection hole of each insulating support block is provided with a heat-conducting board; the top and the bottom of the heat-conducting board are connected with the outer circuit board and the inner circuit board respectively; assembly slots are formed in the joints of the semi-cured layer, the inner board substrate layer and the heat-conducting board; and left and right side walls of the heat-conducting board are provided with heat-dissipating sheets. Through adoption of the multilayer flexible circuit board, the utilization rate of the circuit board on the inner layer is increased,and meanwhile relatively good impact effect and heat-dissipation effect are achieved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a multilayer flexible circuit board for flat panels. Background technique [0002] With the development of electronic products in the direction of high density and miniaturization, the printed circuit boards supporting electronic products are also gradually developing in the direction of lightness, thinness and flexibility. Among them, the flexible printed circuit board (FPC) is more and more widely used in electronic products due to its advantages such as bendability, folding, three-dimensional wiring, and three-dimensional space interconnection. The flexible circuit board is based on polyimide or polyester film. A flexible printed circuit board made of base material with high reliability, free bending, winding and folding. Multilayer flexible circuit board is the basic trend and direction of FPC product development at present. The production of multi-layer flex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/02
CPCH05K1/0207H05K1/021H05K1/0271H05K1/115
Inventor 单金林段小篇姜文军
Owner 扬州市玄裕电子有限公司
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