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Vibration sensor and audio equipment

A vibration sensor and diaphragm technology, applied in the field of sensors, can solve the problems of low vibration response and poor effect, etc.

Pending Publication Date: 2018-09-07
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the existing MEMS vibration sensor includes a vibration sensing device and a vibration detection device that converts vibration into an electrical signal. Since the vibration sensing device and the vibration detection device are integrated together, and because the vibration detection device adopts piezoelectric or capacitive induction, It can only be sensed under the pressure of direct extrusion contact, making it sensitive to low frequency 1kHz vibration, and the effect in the audio field is poor.

Method used

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  • Vibration sensor and audio equipment
  • Vibration sensor and audio equipment
  • Vibration sensor and audio equipment

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0037] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0038] In addition, the ...

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Abstract

The invention discloses a vibration sensor and audio equipment. The vibration sensor comprises a shell which is provided with an accommodating cavity with an opening; a circuit board component that isfixedly connected with the shell and blocks the opening; an MEMS microphone that is arranged on one surface of the circuit board component, positioned in the accommodating cavity, and electrically connected with the circuit board component; a first vibration film that is arranged on the inner wall surface of the accommodating cavity; a mass block that is fit with the surface of the first vibration film, wherein when a vibration signal or a pressure signal is input from one side, far away from the accommodating cavity, of the shell, the first vibration film and the mass block vibrate, so as todrive the air pressure in the accommodating cavity to change. The technical scheme provided by the invention aims at enabling the vibration sensor to have good vibration response to high frequency vibration and low frequency vibration, and thus the effect of the vibration sensor applied to the audio field is enhanced.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a vibration sensor and audio equipment using the vibration sensor. Background technique [0002] At present, the existing MEMS vibration sensor includes a vibration sensing device and a vibration detection device that converts vibration into an electrical signal. Since the vibration sensing device and the vibration detection device are integrated together, and because the vibration detection device adopts piezoelectric or capacitive induction, It can only be sensed when it is directly squeezed and contacted by pressure, making it sensitive to vibrations at low frequencies <500Hz, but has a low response to vibrations at high frequencies >1kHz, and the effect in the audio field is poor. Contents of the invention [0003] The main purpose of the present invention is to provide a vibration sensor, which aims to make the vibration sensor have better vibration response to both ...

Claims

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Application Information

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IPC IPC(8): H04R19/04G01H17/00G01H11/06
CPCH04R19/04G01H11/06G01H17/00
Inventor 王友潘新超
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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