LED wafer bonding method
A wafer and bonding technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low utilization rate of the backplane and occupying precious space of the backplane, and achieve the effect of saving space and improving utilization rate.
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[0035] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention, and in the absence of conflict, the present invention The embodiments and the features in the embodiments can be combined with each other.
[0036] The invention provides a bonding method for LED chips.
[0037] see figure 1 , in an embodiment of the bonding method of the LED chip of the present invention, the bonding method of the LED chip comprises the following steps:
[0038] Step S100, providing a substrate.
[0039] Specifically, sapphire substrates can generally be selected as substrates. Sapphire substrates have many advantages: first, the production technology of sapphire substrates is mature and the quality is good; second, sapphire substrates have good st...
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