PCB substrate conveying mechanism for chip mounter

Abstract

The invention relates to the technical field of chip mounters, in particular to a PCB substrate conveying mechanism for a chip mounter. The PCB substrate conveying mechanism comprises a movable side conveying plate, a fixed side conveying plate and a top plate, wherein the movable side conveying plate and the fixed side conveying plate which are in parallel are parallel to the top plate. A conveying belt is mounted on the movable side conveying plate and the fixed side conveying plate, the fixed side conveying plate is fixed on the upper part of the top plate, and the movable side conveying plate is also mounted on the upper part of the top plate. When a PCB substrate is conveyed to the middles of the conveying plates through the conveying belt and the top plate moves upwards perpendicularto the PCB substrate, plate conveying small cover plates on the movable side conveying plate and the top plate act on the PCB substrate at the same time, so that the PCB substrate is firmly clamped and accurately positioned; belt supporting plates are additionally mounted in the conveying belt, and the PCB substrate is prevented from being stuck in the conveying process; the plate conveying smallcover plates on the movable side conveying plate can be adjusted left and right, and the mounting work when a component exists at the most edge of the PCB substrate is facilitated; and a blocking aircylinder and sensor integrated device mounted on the fixed side conveying plate can be adjusted forwards and backwards, and the chip mounter with the PCB substrate conveying mechanism can met the mounting requirements on the accurate positioning, high precision and high efficiency.

Description

technical field [0001] The invention relates to the technical field of placement machines, in particular to a PCB substrate transmission mechanism of a placement machine. Background technique [0002] The placement machine is the most critical equipment in the SMT (Surface Mount Technology) industry. SMT (Surface Mount Technology) is a comprehensive technology emerging due to the development of semiconductor process technology, involving electronic components, welding and assembly technology etc. It is mainly used for the placement of electronic components. As the key to the realization of SMT technology, the placement machine has also attracted much attention in its research and development. The PCB board is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. The design and manufacturing quality of PCB boards directly affect the quality and cost of the entire product, and even lead to t...

AI Technical Summary

Problems solved by technology

[0003] However, there are many problems in the current PCB substrate transfer mechanism of the placement machine, such as the side clip cylinder push rod is thin, the thrust is small, and the force is uneven; some PCB boards are placed on the edge of the board, and the top board cannot be mounted after the top board is lifted. ; There is no supporting plate between the transmission pulleys, which is easy to jam; finally, it is more troublesome to separate the adjustment of the blocking cylinder and the sensor

These problems in the PCB substrate transmission process seriously affect the efficiency and placement quality of the placement machine, and the produced PCB boards cannot meet the quality requirements. If they are scrapped, it will have a huge impact on the economic benefits of the production enterprise.

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