Fabrication method of arbitrary-configuration three-dimensional conductive metal micro-nano structure

A technology of micro-nano structure and manufacturing method, which is applied in the direction of metal material coating process, coating, liquid chemical plating, etc., to achieve the effect of flexible control, high mechanical strength and high fidelity

Pending Publication Date: 2018-08-17
EAST CHINA NORMAL UNIV
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the challenges and bottlenecks in the current manufacture of three-dimensional conductive metal micro-nano structures, and provide a method for manufacturing three-dimensional metal micro-nano structures with high efficiency, rapidity, arbitrary configuration design, and stable and firm work.

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  • Fabrication method of arbitrary-configuration three-dimensional conductive metal micro-nano structure
  • Fabrication method of arbitrary-configuration three-dimensional conductive metal micro-nano structure

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with the embodiments and accompanying drawings, but the protection scope of the present invention should not be limited thereby. see figure 1 , figure 1 It is a schematic flow chart of the fabrication of three-dimensional conductive metal micro-nano structures with arbitrary configurations.

[0023] Now take quartz glass as an example to illustrate the present invention, by figure 1 It can be seen that the method for integrating a three-dimensional conductive metal micro-nano structure in glass using a femtosecond laser in the present invention includes the following four steps:

[0024] (1) Femtosecond laser irradiation: take a clean quartz glass sample 6 with a size of 10 mm×10 mm×2 mm and six sides polished, and fix it on a three-dimensional translation stage; the femtosecond laser directly writes microchannels inside the quartz glass sample When patterning, the central wavelength is 515 nm, the ...

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Abstract

The invention discloses a fabrication method of an arbitrary-configuration three-dimensional conductive metal micro-nano structure. The fabrication method comprises the following steps that a femtosecond laser micromachining technology is utilized to fabricate a three-dimensional microchannel in a transparent material, then a chemical plating solution is continued to be transmitted by a peristaltic pump to pass through the microchannel for surface modification and subsequent metal layer deposition in the microchannel, and finally a transparent material base is removed through chemical etching,and the arbitrary-configuration three-dimensional conductive metal micro-nano structure is obtained. The fabricated arbitrary-configuration three-dimensional conductive metal micro-nano structure hasthe characteristics that the spatial configuration can be designed arbitrarily, the size can be adjusted, the conductivity is high and a melting point is high, and has very large application prospects in the fields such as microelectronics, photonics, a micro-nano motor system, micro-nano transducing and catalysis.

Description

technical field [0001] The invention relates to the manufacture of a three-dimensional metal micro-nano structure and femtosecond laser micromachining, in particular to a method for manufacturing a three-dimensional conductive metal micro-nano structure by combining femtosecond laser micromachining with flow chemical plating and chemical corrosion. This method is applicable to the manufacture of gold, silver, platinum, nickel and other metal structures. Background technique [0002] The three-dimensional metal micro-nano structure has the dual characteristics of metal and three-dimensional three-dimensional micro-nano structure, and has shown great application potential in the fields of microelectronics, photonics, chemical sensing, biomedicine and so on. Compared with the two-dimensional metal micro-nano structure, the dimensional expansion of the three-dimensional metal micro-nano structure can provide stronger and more uniform spatial localized electromagnetic field contr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/31C23C18/44C23C18/18
CPCC23C18/1893C23C18/31C23C18/44
Inventor 程亚徐剑敬承斌李晓龙钟熠
Owner EAST CHINA NORMAL UNIV
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