Decoder and electronic device with the decoder

Abstract

The present invention provides a decoder and an electronic device having the decoder, the decoder includes: a first number of control bits and 2 controlled by the control bits m Row switch array, m is a natural number, each row of the switch array includes n 1 row n 2 row of MOSFETs, the MOSFETs include N-type MOSFETs and P-type MOSFETs, and the number of N-type MOSFETs and P-type MOSFETs controlled by each control bit is 2 n , n is a variable, n is a natural number, and the value of n decreases with the order of the control bits from high to low, and some of the MOSFETs controlled by the control bits are in the 2 m The rows are uniformly distributed in the row switch array, and the row numbers of the switch array where the MOSFETs controlled by some of the control bits are located are arranged in a second-order arithmetic sequence. The invention can optimize the layout of the switch of the decoder, and reduce the influence of the gradient error and the temperature field error on the decoder.

Description

technical field [0001] The invention relates to the technical field of control circuits, in particular to a decoder and an electronic device with the decoder. Background technique [0002] A decoder is a circuit that can translate an input binary code into an output signal to represent its original meaning. The layout of the switch of the decoder is very important and directly affects the performance index of the decoder. [0003] An important performance index of the decoder is the current source matching error, and the current source matching error is mainly manifested in the layout design of the switch of the decoder: [0004] (1) Random matching error. The random error is determined by the matching characteristics and depends on the size of the unit switch. Usually, the size of the unit switch tube is increased as much as possible to reduce the adverse effects of the random matching error on the circuit, but at the same time it will make the switch Arrays have larger a...

AI Technical Summary

Problems solved by technology

In the switch array, since the units and devices are connected by metal, there is resistance in the metal connection, and there is a gradient change in the voltage along the direction of the power line, and this voltage gradient change will cause a gradient error in the switch

[0006] (3) Temperature field error. The chip will dissipate heat when working, so that the temperature on the chip will gradually decrease from a certain point to the surroundings, resulting in a certain temperature field error for each switch of the chip. For a large-area switch tree array, especially obvious

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