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Automatic SMD carrier tape adhesive film splicing machine

A technology of splicing machine and carrier tape, which is used in thin material processing, strip winding, transportation and packaging, etc., can solve the problems of low parallel connection efficiency, high labor cost, and parallel connection.

Pending Publication Date: 2018-07-27
深圳市洋浦科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, the splicing of carrier tapes is often done manually, resulting in low splicing efficiency, high labor costs, and high work intensity for workers.
There are also some mechanical equipment that can realize automatic parallel connection of carrier tapes, but these mechanical devices have a single function, poor parallel connection effect, and cannot be used for parallel connection of carrier tapes of various specifications; in addition, existing parallel connection equipment can only be connected separately Work, unable to network and read barcodes, etc., which is not conducive to the establishment and application of modern engineering MES systems

Method used

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  • Automatic SMD carrier tape adhesive film splicing machine
  • Automatic SMD carrier tape adhesive film splicing machine
  • Automatic SMD carrier tape adhesive film splicing machine

Examples

Experimental program
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Embodiment Construction

[0085] The present invention is further described below in conjunction with accompanying drawing and embodiment:

[0086] Such as figure 1 As shown, a kind of automatic SMD carrier tape adhesive film splicing machine includes a frame 100, a cam system 200, a film transfer mechanism 300 and a vacuum film transfer mechanism 400 are arranged above the frame 100, and the frame 100 is equipped with a The motion controller 111 and the motion controller 11 are respectively connected to the cam system 200 , the parallel film transfer mechanism 300 and the vacuum suction film transfer mechanism 400 .

[0087] Such as Figure 2-3 As shown, the frame 100 includes upper and lower layers, and the motion controller 111 is placed on the upper layer, and the motion controller 111 is connected with the motor driver 112 and the integrated industrial control host 116. The motion controller 111 is installed on the electrical installation board 110, and the integrated industrial control host A p...

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PUM

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Abstract

The invention belongs to the technical field of SMD carrier tape splicing, and particularly relates to an automatic SMD carrier tape adhesive film splicing machine. The automatic SMD carrier tape adhesive film splicing machine comprises a rack, a cam system, a splicing film conveying mechanism and a vacuum film-suction transfer mechanism are arranged above the rack; a carrier tape charging tray, abarcode printer, a stapler splicing pliers, a waste recycling drawer, a manual carrier tape slicing, a display and an operation interface are arranged at the outside of the rack; the cam system includes a closed loop stepping motor, synchronous wheels, pressure roller movable cams of a carrier tape conveying mechanism, movable control cams of a carrier tape cutter mechanism and control cams of asplicing lifting platform; the splicing film conveying mechanism comprises a carrier tape roll, a carrier tape motor, a rack motor and a plurality of transfer wheels; and according to the vacuum film-suction transfer mechanism, a vacuum suction head is driven by a screw motor and the rack motor to suck and transfer a splicing film to the film pasting position. The automatic SMD carrier tape adhesive film splicing machine has the characteristics of high automation degree, high efficiency of carrier tape splicing, good consistency and high universality, and barcode printing provides conveniencefor tracking, contrasting and error proofing.

Description

technical field [0001] The invention relates to the technical field of SMD tape connection, in particular to an automatic SMD carrier tape adhesive film splicing machine. Background technique [0002] On the SMT production line of electronics factories, the specifications of carrier tapes commonly used in placement machines include: 8mm, 12mm, 16mm, 24mm, 32mm, 44mm, 56mm, 72mm, 88mm, etc., among which 8mm is the standard carrier tape, covering the most specifications electronic mount components. [0003] In the prior art, the splicing of carrier tapes is often done manually, which results in low splicing efficiency, high labor costs, and high work intensity of workers. There are also some mechanical equipment that can realize automatic parallel connection of carrier tapes, but these mechanical devices have a single function, poor parallel connection effect, and cannot be used for parallel connection of carrier tapes of various specifications; in addition, existing parallel...

Claims

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Application Information

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IPC IPC(8): B65H21/00
CPCB65H21/00B65H2701/11332B65H2701/1752
Inventor 黎艺文
Owner 深圳市洋浦科技有限公司
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