Method for detecting thermal design rationality of electronic product based on infrared thermal imaging technology

Abstract

The invention discloses a method for detecting the thermal design rationality of an electronic product based on an infrared thermal imaging technology, which comprises the steps that infrared imagingdata of a product to be detected is captured through an infrared thermal imaging instrument, the data is transmitted to a computer, and the computer analyzes and judges the measured data according toset detection standards so as to complete detection for the thermal design rationality of the electronic product. The infrared thermal imaging instrument is taken as a main body for detection, and only the handheld infrared thermal imaging instrument is required to be selected to perform detection on a normally operating or aging product; and the operation is flexible, the coverage is comprehensive, and the universality is high. Compared with the prior art, the operation difficulty can be reduced, the test time can be saved, and the risk of test omission is eliminated. The thermal design rationality serves as a necessary item for the hardware reliability in the research and development and sample design finalizing stages of the electronic product; thermal design defects are effectively measured and discovered before mass production of the electronic product, thereby performing rectification and remedy timely, and being capable of effectively reducing the failure rate and the quality cost of the electronic product after mass production.

Description

technical field [0001] The invention relates to a method for detecting electronic products, in particular to a method for detecting the rationality of thermal design of electronic products based on infrared thermal imaging technology. Background technique [0002] With the development of electronic technology, various electronic products are highly integrated, with dense circuits and tiny devices, more powerful functions, higher configurations, and faster operating speeds. However, if electronic products are used for a long time, the temperature rise of CPU, semiconductor tubes, high-power resistive capacitors, etc. will increase, and the performance and life will decrease sharply. At least it will cause the product to crash, and at the worst it will cause function failure and product burnout. As with all electronic devices, only within the appropriate temperature range can the device work properly and last. This is especially true for temperature-sensitive devices. For exa...

AI Technical Summary

Problems solved by technology

Although the temperature test of single-point conduction can be realized, it cannot be quickly and effectively measured without dead ends, and the overall temperature convection and radiation of the product cannot be grasped. To achieve a comprehensive temperature distribution test of the product, it is necessary to test each point one by one, which greatly increases The work of testers is difficult, and the work efficiency is low. At the same time, it is easy to miss key points due to the experience and meticulousness of the testers.

Due to the limitation of the detection device, the device that is too small cannot be tested at all, and it becomes a blind area of ​​temperature rise management, leaving a fatal hidden danger to the product

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