A method of laser cutting glass

Abstract

The invention discloses a method for cutting glass by laser. The method comprises the following steps of S1, glass cleaning: using cleaning liquid for cleaning the glass to be cut; S2, primary cutting: fixing the glass cleaned in the S1 onto a cutting work table; moving the work platform according to a preset track; performing primary cutting on the glass; S3, ozone treatment: performing ozone treatment on the glass subjected to primary cutting in the S2; S4, secondary cutting: performing secondary cutting on the glass subjected to ozone treatment in the S3 along the cutting mark in the S2 toobtain the glass of the specified specification. The method has the beneficial effects that the edge effects are reinforced; the cutting quality is good; no crack is generated; no secondary pollutionis caused.

Description

technical field [0001] The invention belongs to the field of manufacturing amorphous silicon solar cells, and in particular relates to a method for laser cutting glass. Background technique [0002] Amorphous silicon (a-Si) solar cells are deposited on a conductive glass substrate by plasma reaction to deposit p-type, i-type, and n-type three-layer a-Si in sequence, and then vapor-deposit metal electrode aluminum (Al). The glass surface is incident, and the battery current is drawn out from the transparent conductive film and aluminum, and finally encapsulated with ethylene-vinyl acetate copolymer (EVA) and bottom glass. At present, the first step in the production of amorphous silicon (a-Si) solar cells is to use a sanding belt to grind the corners of the glass to reduce the stress on the edge of the glass, which takes a long time, the quality of the grinding is unstable, and the edge is prone to cracking. Problems such as wasting materials, and at the same time, after pol...

AI Technical Summary

Problems solved by technology

In this invention, the heat absorbing layer is covered on the substrate to reduce the size of the temperature gradient during cutting, reduce the generation of thermal stress, and further reduce the generation of defects such as cracks, so as to obtain products with better quality. Cloth or sputtering or vapor deposition is used to cover the substrate to be cut, the process is complicated, and it is easy to cause uneven coating of the heat absorbing layer, which affects the cutting quality