An inorganic integrated deep ultraviolet LED packaging structure

A technology of LED packaging and deep integration, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting the service life of deep ultraviolet LEDs, poor anti-aging and sealing performance, and poor heat dissipation effect, so as to prevent organic matter from aging and falling off, Good sealing and guaranteed stability

Active Publication Date: 2020-02-07
SHENZHEN SHANGKE DECORATION TECH CO LTD
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides an inorganic integrated deep-ultraviolet LED packaging structure, which is used to solve the problem of poor anti-aging and sealing performance of the organic packaging structure in the prior art, as well as poor heat dissipation effect, which affects the service life of the deep-ultraviolet LED. The problem

Method used

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  • An inorganic integrated deep ultraviolet LED packaging structure

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Embodiment

[0024] A kind of inorganic integrated deep ultraviolet LED encapsulation structure of this embodiment, refer to figure 1 : Comprising a ceramic substrate 1, an LED chip 2 and a glass cover 3, the top of the ceramic substrate 1 is fixed with a metal support 4, and the top of the metal support 4 is provided with a groove 401, the LED chip 2 is fixed in the groove 401, and the concave The inner wall of the slot 401 is ring-shaped with a corrugated card slot 402, the outside of the glass cover plate 3 is sealed and crimped with a frame 5, the top of the frame 5 is fixed with a corrugated elastic card 6, and the corrugated elastic card 6 is snapped on the corrugated card. In the card slot 402 , the bonding surface of the corrugated elastic card 6 and the corrugated card slot 402 is coated with an inorganic adhesive.

[0025] Circular holes 501 and screw holes 502 are evenly opened on the upper circumference of the frame 5, and the circular holes 501 and screw holes 502 are alternat...

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Abstract

The invention relates to the technical field of a deep ultraviolet LED, and provides an inorganically-integrated deep ultraviolet LED package structure. The inorganically-integrated deep ultraviolet LED package structure comprises a ceramic substrate, an LED chip and a glass cover plate, wherein a metal support is fixedly arranged at the top of the ceramic substrate, a groove is formed in the topof the metal support, the LED chip is fixed in the groove, a wavelike clamping groove is annularly formed in an inner wall of the groove, a frame is hermetically clamped outside the glass cover plate,and a wavelike elastic clamping sheet is fixedly arranged at the top of the frame and is clamped into the wavelike clamping groove in a matching way. The inorganically-integrated deep ultraviolet LEDpackage structure is used for solving the problems of poor aging resistance, poor sealing performance, poor cooling effect and influence in service lifetime of the deep ultraviolet LED of an organicpackage structure in the prior art.

Description

technical field [0001] The invention relates to the technical field of deep ultraviolet LEDs, in particular to an inorganic integrated deep ultraviolet LED packaging structure. Background technique [0002] Ultraviolet LEDs generally refer to LEDs with a luminous center wavelength below 400nm, but sometimes they are called near-ultraviolet LEDs when the luminous wavelength is greater than 380nm, and deep-ultraviolet LEDs when they are shorter than 300nm. Due to the high bactericidal effect of short-wavelength light, ultraviolet LEDs are often used for sterilization and deodorization of refrigerators and home appliances; at present, organic materials such as silica gel and epoxy resin are used to seal and protect the chip in LED packaging, and these materials are transparent. Good performance, easy to operate, can improve light extraction efficiency, but poor UV resistance, poor anti-aging performance, easy to age and deteriorate in ultraviolet environment, using traditional ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/56H01L33/64
CPCH01L33/486H01L33/56H01L33/641
Inventor 马达罗江华胡海涛徐子杰
Owner SHENZHEN SHANGKE DECORATION TECH CO LTD
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