Novel deep ultraviolet LED package structure

Abstract

The invention relates to an LED package structure, in particular to a novel deep ultraviolet LED package structure. The novel deep ultraviolet LED package structure comprises a transparent bottom plate, wherein a transparent dam is fixedly arranged on the transparent bottom plate, the top of the transparent dam is hinged with a transparent upper cover by a rotation shaft, a sealing cushion is arranged at the bottom of the transparent upper cover, buckles are arranged on the transparent upper cover and the transparent dam and are matched with each other, an LED substrate is arranged above the transparent bottom plate, a deep ultraviolet LED is fixedly arranged on the LED substrate, an insertion rod is fixed relative to the bottom of the LED substrate, a first clamping block is fixedly arranged at the bottom of the insertion rod, a first opening is formed in the transparent bottom plate and is matched with the insertion rod and the first clamping block, partition plates are oppositely arranged at two sides of the first opening and in the transparent bottom plate, the partition plates are connected with a pull rod by springs, a second clamping block is fixedly arranged at one end of the pull rod and is matched with the first clamping block, and the other end of the pull rod extends out of the top of the transparent bottom plate. With the novel deep ultraviolet LED package structure provided by the technical scheme, the defect of inconvenience in experiment and improvement due to the LED substrate fixed in the package structure in the prior art can be effectively overcome.

Description

technical field [0001] The invention relates to an LED packaging structure, in particular to a novel deep ultraviolet LED packaging structure. Background technique [0002] Generally speaking, the function of packaging is to provide enough protection for the chip to prevent the chip from being exposed in the air for a long time or fail due to mechanical damage, so as to improve the stability of the LED chip. For LED packaging, it also needs to have good light extraction efficiency and good heat dissipation. Good packaging can make LEDs have better luminous efficiency and heat dissipation environment, thereby improving the life of LEDs. [0003] The current development of the domestic LED packaging industry is relatively mature, forming a complete LED packaging industry chain. In terms of regional distribution, the Pearl River Delta region is the region with the most concentrated LED packaging enterprises and the largest industrial scale in mainland China. The number of ente...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above-mentioned shortcomings existing in the prior art, the present invention provides a novel deep-ultraviolet LED packaging structure, which can effectively overcome the defects in the prior art that are not convenient for experimentation and improvement due to the fact that the LED substrate is fixed in the packaging structure.

Images