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bga rework station with adjustable air outlet

A technology for rework stations and air outlets, which is applied in the secondary processing of printed circuits, etc. It can solve the problems that the size of the air outlet cannot be adjusted, BGA chips spread around, and influence, etc., and achieve the effect of improving the efficiency of desoldering and shortening the time of desoldering

Active Publication Date: 2019-09-03
重庆川乾科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention intends to provide a BGA rework station with adjustable air outlet to solve the problem that the air outlet of the existing BGA rework station cannot be adjusted in size and the blown air spreads around and affects BGA chips that do not need to be desoldered

Method used

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  • bga rework station with adjustable air outlet

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Embodiment Construction

[0028] Further detailed explanation through specific implementation mode below:

[0029] The reference signs in the drawings of the description include: machine 1, hot air nozzle 2, air outlet 3, regulating shell 4, opening 5, rotating shaft 6, first impeller 7, socket 8, centrifugal fan 9, casing 91, second Impeller 92, suction port 10, output port 11, through hole 12, air outlet hole 13, delivery pipe 14, exhaust pipe 15, rolling bearing 16, bolt 17, connecting block 18.

[0030] like figure 1 As shown, the BGA rework station with adjustable air outlet 3 of the present invention includes a machine 1 and a hot air assembly. The hot air assembly includes a heater and a hot air nozzle 2. The air outlet 3 is formed at the hot air nozzle 2, and the hot air nozzle 2 is covered with a regulating shell. 4. The adjusting shell 4 is detachable relative to the hot air nozzle 2. In this embodiment, the adjusting shell 4 and the hot air nozzle 2 are connected by bolts 17, such as figur...

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Abstract

The invention discloses a BGA rework station provided with an adjustable air outlet and relates to the field of integrated circuit maintenance equipment. The BGA rework station comprises the air outlet formed at a hot air nozzle, the hot air nozzle is sleeved with an adjusting case, and an opening with the size smaller than that of the air outlet is formed in the adjusting case; a rotary shaft isrotationally connected in the hot air nozzle, a first impeller is fixedly connected onto the rotary shaft, and two ends of the rotary shaft extend into the adjusting case; two ends of the rotary shaftare sleeved with centrifugal fans, each centrifugal fan comprises a suction port and an output port, a through hole is also formed in one side, where the opening is formed, of the adjusting case, anair outlet is formed in one side, away from the opening, of the adjusting case, a delivery pipeline and an exhaust pipeline are arranged in the adjusting case, the through hole and the suction port are communicated through the delivery pipeline, and the output port and the air outlet are communicated with the exhaust pipeline. The problems that the size of air outlets of existing BGA rework station cannot be adjusted and air blown out by the air outlets diffuse all around to affect BGA chips not needing desoldering are solved, and the BGA rework station is mainly applied to dismounting and welding in the BGA chip rework process.

Description

technical field [0001] The invention relates to the field of integrated circuit board maintenance equipment, in particular to a BGA rework station with an adjustable air outlet. Background technique [0002] At present, in the electronic industry and other technical fields, the core technology of electronic products - the assembly technology of printed circuit boards is undergoing tremendous changes, supporting the transformation of electronic product component packaging to high-density packaging. BGA chips have the characteristics of multiple pins, large information processing capacity, and small chip size, and have been widely used in the field of digital communications (such as mobile phones, IPTV, handheld secure communication equipment, etc.). At present, the soldering technology of BGA chips has become an indispensable key technology in the assembly of printed circuit boards. The BGA rework station is an intelligent operation device for visual alignment, welding and d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22
Inventor 何富强
Owner 重庆川乾科技有限公司
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