Laminating mechanism with recyclable welding die
A welding die and lamination technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the dislocation of the bottom plate and top cover of the welding die, the dislocation of the upper and lower sheets, and the low lamination efficiency, etc. problems, to achieve the effect of reducing the failure rate, reducing the number, and reducing the failure rate
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[0058] Figure 1~13 It is the best embodiment of the present invention, below in conjunction with attached Figure 1~13 The present invention will be further described.
[0059] A kind of sheet-combining mechanism for welding mold recycling, comprising a welding mold input module 6 and a top cover conveying module 9 and a bottom plate conveying module 10 arranged on one side of the welding mold input module 6, the input end of the top cover conveying module 9 and the welding mold A mold-opening manipulator 7 is arranged between the input modules 6, a sheet ejection manipulator 3 is arranged between the input end of the base plate conveying module 10 and the welding mold input module 6, and between the output end of the top cover conveying module 9 and the base plate conveying module 10 A mold clamping manipulator 14 is provided, and the mold clamping manipulator 14 is provided with a top cover grasping part and an upper material grabbing part, and a lower material transfer ma...
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