Chip stripping device

Abstract

The invention provides a chip stripping device. The chip stripping device includes an absorption platform used for absorbing a blue film, wherein an absorption face of the absorption platform is provided with a plurality of absorption holes; a boss used for pre-demolding a chip and arranged in the absorption platform capable of moving upward and downward in a direction perpendicular to the absorption face so as to enable the boss to protrude from the absorption face or to be accommodated in the absorption platform; a jacking needle used for jacking the chip so as to stripping the blue film andarranged in the boss and capable of moving upward and downward in a direction perpendicular to the absorption face relative to the boss so as to enable the jacking needle to protrude from the boss orto be accommodated in the boss; a first lifting mechanism used for driving the absorption platform to move upward and downward and connected with the absorption platform; and a second lifting mechanism used for driving the jacking needle to move upward and downward and connected with the jacking needle. In this way, the chip can be stripped gradually and chip failure can be avoided effectively.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a chip stripping device. Background technique [0002] With the development of the integrated circuit industry, integrated circuit (Integrated Circuit, referred to as IC) chips are becoming thinner and thinner, so IC packaging technology is developing rapidly in the direction of low power consumption, small size, high speed, and high integration. To meet the development needs of higher chip frequency, increased number of pins, reduced pin spacing, and improved reliability. As an indispensable key process step in the packaging process, the chip lift-off process plays an important role in the subsequent packaging process and product performance. At present, for the pick-up and peeling of ultra-thin chips below 50-100 μm, it is usually necessary to use the jacking force of the ejector pin of the chip peeling device to peel the chip from the blue film. However, since...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide a chip peeling device, which solves the problem that in the process of picking up and peeling ultra-thin chips, the back of the ultra-thin chip is prone to local damage or scratches due to the force of the ejector pin, thus easily causing chip damage. failure problem

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