Manufacturing process of PCB circuit board

Abstract

The invention discloses a manufacturing process of a PCB circuit board. The manufacturing process comprises the following steps of 1, manufacturing a vacancy for pre-placing a passive device in an inner layer of a PCB substrate; 2, enabling the passive device to be embedded in the vacancy, and performing substrate cutting; 3, performing silk-screen printing of an insulating heat conducting material on the substrate to form an insulating layer, putting the substrate printed with the insulating layer into a drying oven to be half-cured, wherein the temperature of the drying oven is 125-160 DEG Cand the baking time is 15min or less; then putting the substrate into a hot press to be laminated for 15min at the hot pressing temperature of 145 DEG C; 4, performing circuit bonding, and performingsilk-screen printing of circuit base glue on the insulating layer obtained in the step 2, printing composite conductive powder on the circuit base glue, putting into the drying oven for 5min at a temperature of 140 DEG C; and next, putting into the hot press to be laminated for 15min at a temperature of 145 DEG C; and 5, drilling a conductive through hole, and enabling the passive device to be connected with circuit on the surface of the PCB substrate. The PCB circuit board is simple in structure and high in reliability, and the stability of the circuit board can be improved effectively.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a process for producing a PCB circuit board. Background technique [0002] In the 21st century, human beings have entered a highly informationized society, and PCB is an indispensable and important pillar in the information industry. At the same time, electronic equipment requires high performance, high speed, light weight and shortness, and as a multidisciplinary industry, PCB is the most critical technology for high-end electronic equipment. In PCB products, whether rigid, flexible, rigid-flexible multilayer boards, or module substrates for IC packaging substrates, they have made great contributions to high-end electronic equipment. Therefore, the PCB industry occupies an important position in electronic interconnection technology . [0003] PCB products are developing towards high-level, high-density, and high-frequency signals, but a large numbe...

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Problems solved by technology

[0003] PCB products are developing towards high-level, high-density, and high-frequency signals, but a large number of passive devices on the surface of the current PCB circuit board occupy a large amount of surface area of ​​the PCB, and at the same time require a large number of wires, via holes and connection pads , waste a lot of PCB layout and space, the production process is cumbersome, and its ability to resist mechanical vibration shock, moisture, pollution and corrosive gases is low, which greatly affects its mechanical and electrical properties