Heat management device with heat leading and directional heat aggregation functions

Abstract

The invention relates to a heat management device with heat leading and directional heat aggregation functions. The heat management device comprises a cylindrical base body, a heat source and a heat aggregation part; the heat source is of a columnar body structure arranged at the center of the cylindrical base body and with the height being equal to that of the cylindrical base body; the heat aggregation part is a plurality of fan-shaped structures arranged in the cylindrical base body and circumferentially arranged around the heat source; and the heat aggregation part and the cylindrical basebody have the same height, the short arc surface side of the heat aggregation part is away from the heat source, and the heat aggregation part is formed by arranging of two materials with different heat conductivity in the circular arc directions of the fan-shaped structures in a staggered mode. According to the heat management device, heat flow leading and directional aggregation of the heat source can be achieved, the range of material selection is enlarged, and the heat management device is suitable for the wide temperature range and the wide heat flow range.

Description

technical field [0001] The present invention relates to the technical field of heat management, and more specifically, relates to a heat management device with functions of heat conduction and directional heat accumulation. Background technique [0002] Heat energy is one of the most common forms of energy in the world. Most energy forms are dissipated to obtain heat energy, resulting in a large amount of energy loss and limiting the efficiency of energy utilization. On the other hand, in the fields of energy, power, aerospace and other fields involving many devices or components related to the heat transfer process, it is necessary to consider the thermal impact of heat transfer on the devices or components. Therefore, how to efficiently regulate thermal energy has become an important direction of thermal science research. Designing thermal metamaterials has become one of the effective ways to achieve heat flow control. Thermal metamaterials are doped or arranged in an or...

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Problems solved by technology

[0004] In view of the actual wide application requirements, the existing research still has the following shortcomings: (1) Limited by the thermal conductivity of the material, the upper limit of the operating temperature and other conditions, most research work is only designed at lower temperatures (below 100°C) and low Thermal metamaterials that work under heat flow conditions cannot meet the high temperature and high heat flow application requirements in energy, power, aerospace and other fields; (2) Existing thermal metamaterials can only achieve a single regulation of heat flow, such as heat accumulation, heat rotation etc., it is impossible to realize the coupling of multiple nonlinear heat flow control methods

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