Conductive pattern printing and linear scanning solidification integrated system and method

Abstract

The invention belongs to the technical field of three-dimensional printing, and discloses a conductive pattern printing and a linear scanning solidification integrated system and method. While a multi-axis moving mechanism prints conductive ink on an undeveloped surface, a heating rod below a printing table moves follow a printing head to perform dry surface to accelerate solvent evaporation, photons are used for solidifying linear light source conductive ink after printing to form an electronic circuit. A three-axis-association printing module and a module for scanning photon solidification,a cooling module and a heating moving module which are connected with the three-axis-association printing module are arranged at a working table. According to the conductive pattern printing and the linear scanning solidification integrated system and method, the solidification area is greatly improved in unit time compared with the laser solidification, sintering solidification process is more uniform compared with the flash solidification, the problem that the same area is repeatedly solidified can be avoided, and the uniformity of the electric conductivity of the conductive pattern can be improved; and during solidification, the solidification process is finished when base materials are not heated to the ultimate temperature, the solidification temperature is lowered, and the base materials can be protected from damaging of the high temperature.

Description

technical field [0001] The invention belongs to the technical field of three-dimensional printing, and in particular relates to an integrated system and method of conductive pattern printing, linear scanning and curing. Background technique [0002] In the electronic printing process of conductive patterns printed with nano conductive ink, the most important link is the curing of conductive ink. The sintering and curing process directly determines the conductivity of the conductive pattern and its adhesion to the substrate. The conductive pattern is printed on the substrate made of synthetic resin material by nano-silver ink. The methods currently used for curing include oven heating sintering, laser sintering, microwave sintering and flash sintering curing. Oven heating sintering, laser sintering, microwave sintering and flash sintering curing methods combine conductive ink and substrate to form conductive patterns. However, the performance of conductive ink is not stable...

AI Technical Summary

Problems solved by technology

[0003] To sum up, the problems existing in the prior art are: in the existing conductive pattern fixation method, the conductive ink solidifies slowly during printing, and the ink dripping causes uneven boundaries, uneven surface dryness, and uneven curing.

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