SMT placement process

Abstract

The invention relates to the field of SMT and discloses an improved SMT placement process comprising the steps of a, pickling a PCB; b, performing ultrasonic washing of the PCB; c, drying the PCB; d,brushing solder paste on the PCB; e, performing placement on the PCB using a placement machine; and f, performing reflow soldering of the PCB using a reflow soldering furnace. The method reduces the defective rate of the soldered PCB, ensures the high reliability of the PCB, further saves the manual maintenance cost and improves the quality of the SMT process.

Description

technical field [0001] The invention relates to the field of SMT, in particular to an SMT patching process. Background technique [0002] With the miniaturization and miniaturization of modern electronic products, the selection and use of electronic parts are more towards the surface mount direction. In terms of production and manufacturing, SMT surface mount technology is particularly important. Whether a good electronic product is durable depends not only on the quality of the material itself, but also on the assembly process of the craft. [0003] In the assembly process of electronic products, the electronic parts are pasted or inserted on the PCB board, and then soldered with related machines, which is the SMT process. If the surface of the PCB board is not clean during the manufacturing process of the manufacturer, and there are impurities such as oil stains and dirt, it will have adverse welding effects on electronic parts during the subsequent SMT patch production p...

AI Technical Summary

Problems solved by technology

If the surface of the PCB board is not clean during the manufacturing process of the manufacturer, and there are impurities such as oil stains and dirt, it will have adverse soldering effects on electronic parts during the subsequent SMT patch production process.