Three-dimensional microchannel array liquid cooling structure based on printed circuit board

Abstract

The invention discloses a three-dimensional microchannel array liquid cooling structure based on a printed circuit board. The three-dimensional microchannel array liquid cooling structure comprises atop PCB layer, middle PCB layers and a bottom PCB layer, each middle PCB layer is formed by connecting sections formed by connecting parallel ribs and adjacent ribs into a whole, and flow channels areformed by the space between the adjacent ribs; the ribs of all the middle PCB layers are identical in number and are vertically aligned one to one, connecting bands of all the middle PCB layers are staggered in the length direction so that the flow channels between the corresponding ribs of all the middle PCB layers can be vertically communicated completely; the top PCB layer covers the upper surface of the topmost middle PCB layer, and the bottom PCB layer covers the lower surface of the lowest middle PCB layer to seal the upper surface and the lower surface of a flow channel formed after all the middle PCB layers are combined. A cooling liquid inlet and a cooling liquid outlet are formed in the two ends of the flow channel. According to the three-dimensional microchannel array liquid cooling structure, the problem of heat radiation of an ultrahigh-power device in the printed circuit board and the problem of uneven heat radiation are effectively solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation for electronic components with high heat flux density based on a printed circuit board (PCB), in particular a three-dimensional microchannel array liquid-cooled cooling structure integrated on a printed circuit board. Background technique [0002] At present, various electronic components are developing toward high integration and performance improvement, resulting in a significant increase in thermal power consumption per unit area, and the heat flux density in local areas has reached as high as 100-1000W / cm². The thermal environment of electronic components is getting worse and worse. Traditional heat dissipation methods such as heat conduction and forced air cooling have failed one after another because they exceed their heat dissipation limits. How to achieve high-efficiency heat dissipation has become a key technology that urgently needs breakthroughs for the continued development of...

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings existing in the existing printed circuit board, the purpose of the present invention is to provide a liquid-cooled cooling structure based on the three-dimensional microchannel array of the printed circuit board. problem, and the problem of uneven heat dissipation

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