Double-side heat dissipation refrigerator and semiconductor device

Abstract

The invention proposes a double-side heat dissipation refrigerator. The double-side heat dissipation refrigerator is provided with a liquid inlet hole, a liquid outlet hole and a refrigeration water path, wherein the refrigeration water path communicates with the liquid inlet hole and the liquid outlet hole and comprises two water flow passages respectively along an upper end surface and a lower end surface of the double-side heat dissipation refrigerator, so that a refrigerating liquid flows through the liquid inlet hole, then respectively flows along the two water flow passages and is converged to and flows out of the liquid outlet hole, and heat dissipation of a bidirectional and parallel passage is achieved. Meanwhile, the invention also proposes a package structure of a semiconductordevice employing the double-side heat dissipation refrigerator, the application of a high-power density semiconductor device can be achieved and the reliability of the semiconductor device is ensured.

Description

technical field [0001] The invention belongs to the field of packaging of semiconductor devices, and in particular relates to a double-sided cooling cooler and a semiconductor device using the double-sided cooling cooler. Background technique [0002] A micro-channel refrigerator is a cooling device for high-power semiconductor devices, especially in the field of semiconductor lasers. Micro-channel refrigerators have been widely used for their high heat dissipation capabilities. Chinese patent 201720265903.1 proposes a multi-chip semiconductor laser packaging structure. Specifically, the upper and lower surfaces of the heat sink are packaged with chips, which improves the power density. However, in practical engineering applications, due to the packaging of multiple chips, the heat dissipation of the heat sink Efficiency puts forward higher requirements. Traditional heat dissipation structures such as micro-channel cooling sheets and macro-channel cooling sheets cannot meet ...

AI Technical Summary

Problems solved by technology

Chinese patent 201720265903.1 proposes a multi-chip semiconductor laser packaging structure. Specifically, the upper and lower surfaces of the heat sink are packaged with chips, which improves the power density. However, in practical engineering applications, due to the packaging of multiple chips, the heat dissipation of the heat sink Efficiency puts forward higher requirements. Traditional heat dissipation structures such as micro-channel cooling sheets and macro-channel cooling sheets cannot meet the requirements of heat dissipation efficiency and heat dissipation uniformity of multi-chip packaging, thus restricting the development of this high-power-density semiconductor laser packaging structure. Engineering Applications

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