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Stacking method of packaging material band and warping-prevention jig used for packaging material band

An anti-warping and packaging material technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems affecting the process, the packaging material tape cannot be pressed, etc., to achieve flat and uniform stress, to avoid warping Effect

Pending Publication Date: 2018-02-23
SUZHOU ASEN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the gap between the stacked packaging material tape and the packaging material tape, not only the packaging material tape cannot be flattened, but also it is easy to warp and cut the arc after PMC, which affects the subsequent process

Method used

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  • Stacking method of packaging material band and warping-prevention jig used for packaging material band
  • Stacking method of packaging material band and warping-prevention jig used for packaging material band
  • Stacking method of packaging material band and warping-prevention jig used for packaging material band

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Embodiment Construction

[0013] In order to better understand the spirit of the present invention, it will be further described below in conjunction with some preferred embodiments of the present invention.

[0014] For MIS-type lead frames or packaging substrates, since the pre-packaging process is adopted, the packaging material strips are surrounded by raised borders. In order to prevent the raised frame from affecting the speed and quality of injection molding, the injection mold will be improved, which leads to the presence of raised frames on both sides of the injection-molded encapsulation strip. Therefore, when performing PMC on these injected packaging material strips, the gaps between the stacked packaging material strips are easy to warp, which affects the subsequent manufacturing process.

[0015] The stacking method of packaging material strips and the anti-warping jig provided by the embodiments of the present invention can effectively solve the above problems.

[0016] figure 1 Shown ...

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Abstract

The invention relates to a stacking method of a packaging material band and a warping-prevention jig used for the packaging material band. According to one embodiment of the invention, the warping-prevention jig used for warping prevention of the injection-molded packaging material band; the warping-prevention jig comprises a body and a first matching part; the body has a first surface and a second surface which are arranged oppositely, and a first side surface and a second side surface which are arranged oppositely; the distance between the first surface and the second surface defines the height of the body; the distance between the first side surface and the second side surface defines the width of the body; the first matching part extends in a protruding manner from the first side surface, in a direction from the first surface to the second surface; and the height of the first matching part is lower than that of the body. By virtue of the embodiments of the invention, the problem ofstacking of the MIS type packaging material band can be solved effectively.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for stacking packaging material strips used in the technical field of semiconductors and an anti-warping jig thereof. Background technique [0002] With the development of semiconductor technology, pre-package system (MIS, Mold in System) type lead frames or package substrates are being more and more widely used. Due to the light and thin design of electronic products and the particularity of MIS-type lead frames or packaging substrates, the two ends of the plastic-encapsulated packaging material tape have protrusions. In order to make the encapsulation material strips flat, the stacked encapsulation material strips are usually baked by pressing iron blocks during PMC (PostMold Cure, post-curing). Since there is a gap between the stacked packaging material tapes, the packaging material tapes cannot be flattened, and warping and dicing line arcs are likely to occu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092
Inventor 郭桂冠顾小军
Owner SUZHOU ASEN SEMICON CO LTD
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