Packaging structure and packaging method for rectifier bridge with high thermal conductivity and high insulation and voltage resistance

Abstract

The invention provides a packaging structure and packaging method for a rectifier bridge with high thermal conductivity and high insulation and voltage resistance. The packaging structure comprises arectifier bridge semi-finished product, an aluminum substrate and a plastic frame, the plastic frame is installed on the peripheral side of the aluminum substrate and forms a box-shaped semi-closed body with the top open together with the aluminum substrate, the rectifier bridge semi-finished product is installed in the semi-closed body, and the aluminum substrate comprises an aluminum plate, an aluminum oxide layer formed by oxidizing the outer surface of the aluminum plate and an insulating fiberglass fabric arranged on the aluminum oxide layer in a covering mode. According to the packagingstructure, by forming the aluminum oxide layer on the outer surface of the aluminum plate and combining the aluminum oxide layer with the fiberglass fabric, the insulation and voltage resistance of the material is improved on the condition that the heat dissipation capacity of the rectifier bridge is not influenced; and the heat dissipation performance of the bridge rectifier is improved, the insulation and voltage resistance capacity of the material is improved, the production process is simpler, and production is convenient.

Description

technical field [0001] The invention relates to the technical field of rectifier bridges, in particular to a packaging structure and packaging method of a rectifier bridge with high thermal conductivity and high withstand voltage insulation. Background technique [0002] With the rapid development of current electric vehicles and charging piles, the requirements for the rectifier bridge are getting higher and higher, especially in the case of high current passing, it must be able to continuously and quickly dissipate heat to ensure that the material does not have thermal breakdown during work. The current normal use of large ampere rectifier bridges can be divided into two types. [0003] The first is that the epoxy resin shell is used as the package bottom plate of the rectifier bridge. The plastic shell is formed by injection molding, and an aluminum plate is embedded in the bottom of the plastic shell. There is a 0.5mm epoxy resin layer at the bottom of the plastic shell ...

AI Technical Summary

Problems solved by technology

When the rectifier bridge semi-finished product is welded on the package bottom plate, the copper clad plate of the aluminum substrate needs to be welded at high temperature, and the welding temperature is 350°C to 400°C. At this high temperature, the density of the glass fiber cloth and the firmness of the adhesion are reduced, and the degree of insulation is reduced

The copper-clad plate on the aluminum substrate needs to be laminated with a layer of copper on the upper surface of the aluminum substrate, and then corroded into a corresponding pattern. Glass fiber cloth can also cause damage, reducing the insulation ability of the aluminum substrate

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